Sandblasting process
Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology, presents information on 'sandblasting processing.' This technique involves striking sand against relatively hard substrates such as glass, silicon, and quartz using air pressure to carve out grooves and holes on the substrate surface. ■□■ Features ■□■ ■ Patterns can be created on the substrate surface using dry film resist for sandblasting, allowing for the desired groove processing by masking. ■ The processed surface becomes sandy. ■ Depth control is possible by adjusting the processing time. ■ For more details, please download the catalog or contact us.
Inquire About This Product
basic information
This is an introduction to Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as its core technology. The technique of "sandblasting" involves striking sand against relatively hard substrates such as glass, silicon, and quartz using air pressure to carve out grooves and holes on the substrate surface. ■□■ Features ■□■ ■ Patterns can be created on the substrate surface using dry film resist for sandblasting, allowing for the desired groove processing by masking. ■ The processed surface becomes sandy. ■ Depth control is possible by adjusting the processing time. ■ For more details, please download the catalog or contact us.
Price information
-
Delivery Time
Applications/Examples of results
■□■Applications■□■ ■Flow path ■Through hole ■Light diffusion surface creation, etc.
catalog(1)
Download All CatalogsCompany information
Photo Precision Co., Ltd. is a company that contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as its core technology. Next-generation industrial core products such as MEMS (Micro Electro Mechanical Systems), biochips, and microchemical chips are formed by the complex application of technologies such as nanotechnology, three-dimensional micromachining, high-density three-dimensional packaging, and three-dimensional photolithography. Photofabrication is deeply involved in all of these technologies and serves as the foundational technology for MEMS development. We strive for continuous technical improvement with the support of our customers, while also introducing advanced equipment as much as possible to meet the diverse needs of our clients.