Sandblasting process
- Prototyping is possible from a single piece. - High aspect ratio patterning is achievable. - Patterns can be formed using photolithography, allowing for arbitrary designs. - Machining of grooves and holes in the micron and nanometer range is possible. - Depth control is also available. - Chemical treatment of blasted surfaces is possible. - Conductive processing for through-holes is also supported.
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basic information
In 3D microfabrication for MEMS, we accept small-scale prototypes by spraying ultra-fine particles such as alumina to perform fine cutting processes. We form fine patterns on glass substrates and silicon substrates using dedicated dry film resist, and perform groove formation and hole processing through sandblasting. Additionally, measurement and evaluation using a 3D measuring machine are also possible. [Application Examples] - Substrates for 3D mounting - MEMS substrates - Partition wall formation for PDP - Glass groove processing, through-hole processing - Formation of flow paths for analysis - Surface cutting of substrates for laser light diffusion, etc.
Price information
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Delivery Time
Applications/Examples of results
Outer shape processing, hole drilling, groove processing, surface grinding, etc. on glass substrates and the like.
Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.
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