A device for semi-automatically applying dicing tape to silicon wafers. It is a semi-auto type compatible with 12-inch wafers, providing supply of wafer frames and frame mounting.
● Maximum workpiece: 200-300mm ● Cycle time: 13 seconds per cycle ● Pressurization method: Air cylinder pressurization ● Cutting method: Automatic circular blade cutting ● Machine dimensions: W880×D720×H650mm ● Air source: Dry air 0.5Mpa ● Power supply: AC/100V 3A ● Weight: 120kg
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basic information
A device for semi-automatically applying dicing tape to silicon wafers. It is a semi-auto type compatible with 8/12-inch wafers, and the supply of the wafer frame and the removal of the frame mount are manual. ■ For other functions and details, please contact us or download the catalog. (Contact: Kawaguchi)
Price information
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Delivery Time
P4
Applications/Examples of results
The dicing tape is applied semi-automatically to the Si wafer.
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Company information
The next generation concept, the originality of technological development, the provision of new values... MCK, equipped with a high-level development base, has the know-how to materialize and create all of these. MCK's lamination thrives in various scenes. It constantly senses the forefront of the times and contributes to the development of industrial society.