This vacuum laminator uses vacuum to bond films without bubbles on build-up substrates with uneven surfaces, wafer bonding, COF/FPC substrates, and more.
This vacuum laminator is a device that adheres films without bubbles under vacuum to build-up substrates with uneven surfaces, wafer bonding, COF/FPC substrates, and more.
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basic information
This vacuum laminator is a device that adheres films without bubbles under vacuum to build-up substrates with uneven surfaces, wafer bonding, COF/FPC substrates, etc. It can laminate either in single sheets or continuously. Additionally, by adding a winding and unwinding device, continuous roll-to-roll lamination is possible even in a batch process. For other functions and details, please contact us or refer to the catalog. (Contact: Kawaguchi)
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P4
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The next generation concept, the originality of technological development, the provision of new values... MCK, equipped with a high-level development base, has the know-how to materialize and create all of these. MCK's lamination thrives in various scenes. It constantly senses the forefront of the times and contributes to the development of industrial society.