Widely used in BGA/CSP printer heads and HDDs, etc.
●Effective width: 60 to 160 mm ●Cleaning method: Adhesive rubber roll transfer method ●Pressurization method: Air cylinder pressurization ●Film slitting: One-touch set, upper and lower ●Machine dimensions: W1100 × D4000 × H1800 mm ●Air source: 0.4 MPa or more ●Power supply: φ3 200V 50/60Hz ●Weight: 3000 kg
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basic information
It is widely used in BGA/CSP printer heads and HDDs, etc. With low tension brake, it can transport thin double-layer flex and automatically slit photoresist films and other materials to any desired width while laminating. ■ For other functions and details, please contact us or refer to the catalog. (Contact: Kawaguchi)
Price information
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Delivery Time
P4
Applications/Examples of results
Widely used in BGA/CSP printer heads and HDDs, etc.
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Company information
The next generation concept, the originality of technological development, the provision of new values... MCK, equipped with a high-level development base, has the know-how to materialize and create all of these. MCK's lamination thrives in various scenes. It constantly senses the forefront of the times and contributes to the development of industrial society.
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