This printed circuit board dry film laminator is a device for bonding photosensitive resist film to printed circuit boards. It features a compact design, and...
●Effective width: 100 to 550 mm ●Speed: 0 to 3.0 m/min ●Pressurization method: Air cylinder pressurization ●Temperature control range: Room temperature to 150°C ●Machine dimensions: W1110 × D1200 × H1220 mm ●Air source: 0.5 MPa or higher ●Power supply: φ3 200V 9.5 kW ●Weight: 280 kg
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basic information
This printed circuit board dry film laminator is a device for bonding photosensitive resist film to printed circuit boards. It features a compact design and is easy to operate. Additionally, it has a built-in preheating device, allowing for stable bonding. For other functions and details, please contact us (person in charge: Kawaguchi).
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P4
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The next generation concept, the originality of technological development, the provision of new values... MCK, equipped with a high-level development base, has the know-how to materialize and create all of these. MCK's lamination thrives in various scenes. It constantly senses the forefront of the times and contributes to the development of industrial society.