Basics and synthesis of epoxy resin hardeners, and improvement of heat resistance, moisture resistance, and impact resistance.
A one-day seminar to master heat resistance, moisture resistance, impact resistance, and curing speed to meet the required characteristics of sealing materials, adhesives, electronic substrates, and composite materials.
【Lecturers】 1. Shigeki Inatomi, Technical Advisor (Former Asahi Kasei Fellow), Asahi Kasei Corporation 2. Yoshio Tanioka, Team Leader, Structural Materials Section, Electrical Structural Materials Department, Nagase ChemteX Corporation 3. Masahiko Yamanaka, Group Leader, Senior Researcher, Research and Development Division, Shin Nippon Rika Co., Ltd. 4. Masaki Yoshii, Chief Researcher, Semiconductor Materials Division, Hitachi Chemical Company, Ltd. 【Venue】Industrial Promotion Hall, Room 2【Kawasaki Station, Kanagawa】 【Date and Time】November 25, 2010 (Thursday) 10:00 AM - 4:30 PM 【Capacity】30 people *Registration will close once full. Please apply early.
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basic information
【Lecture Summary】 Phenolic resin-based epoxy resin hardeners are used in electrical and electronic materials applications due to their excellent heat resistance, particularly in combination with epoxy resins that also have a phenolic backbone, especially for semiconductor encapsulants. This lecture will also touch on original products developed by the speaker, involving epoxy resin precursors and phenolic resins and their derivatives as hardeners. 【Lecture Summary】 This presentation will explain the types and characteristics of amine-based hardeners that influence the performance of epoxy resins, and provide examples of hardeners applied in various uses such as adhesives, electrical insulation, coatings, civil engineering and construction, and tools. 【Lecture Summary】 An overview of the types and characteristics of anhydrides used as epoxy resin hardeners will be provided, along with the optimization of mixing ratios and curing conditions. Additionally, several examples of efforts to improve physical properties such as heat resistance, moisture resistance, transparency, impact resistance, adhesion, and storage stability will be introduced. 【Lecture Summary】 Various kinetic equations representing the curing reaction of epoxy resins will be clearly introduced, along with the calculation formulas for curing degree derived from these kinetic equations. Furthermore, methods for determining the curing reaction equations will be presented, along with practical examples.
Price information
47250
Price range
P2
Delivery Time
P2
Applications/Examples of results
Part 1: Synthesis Technology of Phenolic Resin-Based Hardeners and Improvement of Heat Resistance, Moisture Resistance, and Flame Retardancy [10:00-11:20] Part 2: Characteristics and Reactivity of Amine-Based Hardeners and Formulation Technology for Toughness, Heat Resistance, and Low Stress [11:30-12:50] Part 3: Usage of Acid Anhydride-Based Hardeners and Improvement of Heat Resistance and Moisture Resistance [13:40-15:00] Part 4: Analysis Methods for Curing Speed and Curing Degree of Epoxy Resins [15:10-16:30]
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