Quality and service that satisfy our customers.
We conduct wafer testing and laser trimming processing at our state-of-the-art LSI test center (completed in 2006: Motomiya City, Fukushima Prefecture). With the latest environment and equipment, we provide quality and service that satisfy our customers.
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basic information
【Features】 ◯ It provides an optimal testing environment covering from 100mm to 300mm. ◯ Multi-step probing tests, including laser repair/trimming and baking, are consolidated within the same floor. This enables a quicker turnaround time (TAT). ◯ The setup of the testing environment and the operational information of the testers are managed online from wireless terminals. ◯ We also offer consistent support for semiconductor backend processes (package assembly) and electronic device assembly (board mounting). ● For more details, please contact us.
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Applications/Examples of results
Wafer testing and laser trimming processing
Company information
"ARS" is a Latin word that serves as the origin for "ART = art, skill." The company name "Ars" embodies our aspiration to be a group that pursues creative technology that radiates artistic brilliance. Ars Corporation is a subcontractor in the electronic device industry, specializing in semiconductor assembly, wafer reliability evaluation, and SMT implementation of electronic devices. The company was founded in 1972 as "Ars Precision Co., Ltd." focusing on the assembly of camera shutters. In 1979, we expanded into semiconductor packaging, in 1985 into SMT implementation of electronic devices, and further into wafer reliability evaluation in 1989. Manufacturing requires low cost, high quality, and the ability to respond to evolving technologies and diverse needs. This begins with a thorough commitment to every aspect, from manufacturing lead times to quality. We also consider the entire process from semiconductor back-end processes to electronic device assembly, and strive to provide technology and support systems that ensure our customers' peace of mind.