アルス株式会社 Product Lineup

The "TG Series" is a DC/DC converter that pursues high reliability with an easy-to-use case type concept. It includes the "TGS150-12SC-110" with an output of 12V/14A and the "TGS150-24SC-110" with an output of 24V/7A. It guarantees low-temperature startup at -40℃ and is designed for an expected lifespan of 10 years at 100% load at 40℃. 【Features】 ■ Wide input range: exDC110V input: DC60–145V ■ Strong temperature derating: 50℃/100% ■ Long lifespan design: expected lifespan of 10 years at 100% load at 40℃ ■ Low-temperature startup guarantee: guaranteed startup at -40℃ ■ Low standby power design at no load: standby power of less than 1W at no load ■ ON/OFF control: external ON/OFF control *For more details, please refer to the PDF document or feel free to contact us.

• converter

The Cu frame type "Package with Via Holes" is a package that enables the reliable formation of solder fillets due to special processing at the terminal parts. It utilizes patented technology to achieve high soldering quality and improve the appearance inspection after mounting. In standard non-leaded packages, the exposed parts of the lead frame terminals are prone to oxidation, which reduces solder wettability. However, by forming via holes, solder can spread from the plated areas of the via holes, making it suitable for automotive packages with reliable solder joints and visibility for inspection. 【Features】 ■ Reliable formation of solder fillets ■ Achievement of high soldering quality and improved appearance inspection after mounting ■ Package using patented technology ■ Reliable solder joints and visibility for inspection *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing
• Contract manufacturing

The "Package with Via Holes" utilizes a patented technology that allows for the reliable formation of solder fillets through special processing of the terminal parts, achieving high soldering quality and improved visual inspection after mounting. In standard non-lead packages, there are no terminals on the edge of the PCB, so fillets cannot be formed. Additionally, due to the formation of via holes, solder spreads from the plated area of the via holes, resulting in a package that offers reliable solder joints and visibility for inspection. 【Features】 ■ Reliable formation of solder fillets ■ High soldering quality and improved visual inspection after mounting ■ Package using patented technology ■ Reliable solder joints and visibility for inspection *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing
• Contract manufacturing

The "Ultra Low Profile Package" is a product that achieves ultra low profile and low resistance wiring through a structure that does not use conventional Cu frames or interposers such as PCBs. We plan to develop and provide the ultra low profile package with a new package structure using our unique technology. 【Features】 ■ Development and provision of ultra low profile packages using unique technology ■ Structure that does not use conventional Cu frames or interposers such as PCBs ■ Ultra low profile and low resistance wiring package ■ Dimple processing at the terminal area *For more details, please refer to the PDF materials or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing
• Contract manufacturing

"Electronic Component Bulk Storage Services" provides packaging suitable for various semiconductors and sensors based on their applications and characteristics. We offer a wide range of products tailored to specific needs, including "Partial Exposure Packages" that allow parts of devices or components to be exposed, as well as "Hollow Packages" and "Connection Type Packages." [Product Lineup] ■ Partial Exposure Package ■ Hollow Package ■ Connection Type Package ■ Transparent Resin Sealing Package ■ Noise Reduction Package *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Other contract services
• Contract manufacturing

"Electronic Component Bulk Storage Service" offers a service to store packages of various dimensions and shapes from a bulk supply state on a stage to a specified packaging form through image recognition. By incorporating tape rings, we can conduct retesting, eliminating the cumbersome manual tasks during retesting such as sampling and reliability testing. [Features] ■ Storage in specified packaging form ■ Ability to conduct retesting with tape rings ■ Elimination of cumbersome manual tasks during retesting *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Other contract services
• Contract manufacturing

Our company offers a non-lead package with high mounting reliability that utilizes patented technology to improve durability against mechanical stress such as substrate warping and twisting, thanks to a stress-relief material between the leads and the sealing resin. The high mounting strength allows for an alternative to the gull-wing type package, making it effective for miniaturization and low-profile design in automotive applications. 【Features】 ■ Patented technology: Patent No. 2015-139062 (Application date: July 10, 2015) ■ Push strength improved by 57% compared to gull-wing type packages ■ Substrate bending resistance improved by 66% due to the stress-relief material between the leads and sealing resin ■ High mounting reliability *For more details, please refer to the PDF document or feel free to contact us.

• Other Auto Parts

As the demand for SMT circuit board assembly processing shifts towards lighter, thinner, and smaller designs, we leverage our manufacturing technology expertise to support consistent production from mounting to assembly, adjustment, and completion of all high-density surface mount boards. We deliver high-quality products through our long-trusted manufacturing techniques and new surface mount technologies developed through research.

• Processing Contract
• Contract manufacturing

We conduct wafer testing and laser trimming processing at our state-of-the-art LSI test center (completed in 2006: Motomiya City, Fukushima Prefecture). With the latest environment and equipment, we provide quality and service that satisfy our customers.

• Processing Contract
• Contract Inspection

Ars Electronics provides semiconductor assembly solutions that achieve uncompromising quality and high cost performance at a high level. We manufacture advanced processes such as dicing, die attach, wire bonding, mold encapsulation, and final testing for semiconductors (IC/LSI) using state-of-the-art equipment. Within a consistent production system, we respond flexibly and optimally to our customers' diverse needs.

• Other semiconductors