It boasts excellent plate thickness accuracy, opening accuracy, and positional accuracy, as well as high reproducibility in repeat products.
This is a metal mask for solder paste printing manufactured using high-precision additive technology. It is capable of creating masks for IC substrates and wafers.
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basic information
【Features】 ■ The cross-sectional shape of the opening is smooth, allowing for good release of solder paste. ■ Excellent dimensional accuracy and positional accuracy of the openings. ■ High adaptability to the required amount of solder due to the ability to specify any stencil thickness. ■ Thin stencil thickness is also possible. □ For more details, please refer to the catalog.
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Company information
"I always want to be a pioneer." To shape our customers' thoughts into reality, Process Lab Micron is here to help. "Based on a wide range of diverse technologies, we respond precisely to all of our customers' needs." As a top manufacturer of metal masks, our distinguishing feature is that we have continuously developed numerous industry-first technologies with our own hands. Through additive methods and laser processing, we have established new technologies one after another in the world of metal masks, building a technical framework that is "broad and deep." We offer a variety of technical options, from construction methods to support systems, responding precisely to all of our customers' requests. Additionally, to stay closely connected with our customers' sites and incorporate their genuine feedback into product development, we have built a network of bases that covers the entire country.
