Moisture-curing adhesive
This is a moisture-curing adhesive that combines the fast bonding properties of hot melt adhesives with the heat resistance and durability of reactive adhesives. It is suitable for applications such as bookbinding, as it has paper recycling properties and resistance to ink solvents.
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basic information
【Features】 ○ Speeding up adhesive work (high-speed adhesion) ○ Solvent-free ○ Cures with moisture in the environment ○ Heat resistance and solvent resistance ○ Thermal reactivation adhesion is also possible (before reaction) ● For more details, please contact us or refer to the catalog.
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Applications/Examples of results
Building materials, woodworking (wrapping, panels) Automotive, vehicle use (seat covers) Bookbinding Laminating ● For more details, please contact us.
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Company information
Ishizuka Sangyo Co., Ltd. is a company located in Takinogawa, Kita-ku, Tokyo, that deals with industrial adhesives and binding and printing-related machinery.