Thermal conductive adhesive

BERGQUIST Gap Filler TGF 3010 APS - Henkel's innovation in thermally conductive materials marks a significant milestone in achieving sustainability, supporting automotive manufacturers in reaching their SDGs. As global sales of electric vehicles (EVs) surge, the automotive industry, shifting towards electrification, faces the need for unprecedented solutions to produce sustainable and high-performance products. Henkel's Automotive Components division aims to accelerate this change as a specialized partner for OEMs and parts manufacturers. Recently, Henkel introduced its proprietary thermal gap filler solution, enabling a major automotive manufacturer to complete the development of a more sustainable and cost-effective lithium-ion battery pack for EVs, with production now underway to meet consumer demand. The BERGQUIST Gap Filler TGF 3010 APS not only enhances battery longevity through its excellent heat dissipation performance but also addresses various aspects at every stage of the value chain, contributing to the realization of sustainability.

Henkel Japan Corporation's Electronics Division, a Japanese subsidiary of the German chemical and consumer goods manufacturer Henkel, will exhibit at the "9th International Car Electronics Technology Exhibition" (Dates: January 18-20, 2017, Venue: Tokyo Big Sight) and will unveil new products from its thermal management brand BERGQUIST for the first time. At the Henkel Japan booth, the focus will be on the two-component, thermally conductive gap filling material: Gap Filler, which can be applied using a dispenser. The booth will showcase the extensive adoption record of BERGQUIST thermal management products, a diverse lineup including development products, and new sheet-type gap filling material: Gap Pad HC5.0. Demonstrations of the dispenser equipment and hands-on application experiences with air guns will be conducted regularly, providing a total solution that encompasses not only product selection but also the manufacturing process. Additionally, the booth will introduce conductive adhesives, underfill materials, and Technomelt sealants for automotive applications, which are used in a wide range of car electronics and sensor components, including common rail fuel systems, safety devices, engine and powertrain management, infotainment, and lighting.