We are conducting high-level electroless bonding.
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basic information
【Features】 〇 Plating processing of printed circuit boards 〇 Development of surface treatment processes 〇 Support for special substrates as well as high multilayer and large substrates ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Usage】 〇Circuit board processing ●For other functions and details, please contact us.
Company information
Plating processing of printed circuit boards Development of surface treatment processes Support for special substrates to high multilayer and large substrates Main equipment Complete set of bonding gold plating equipment Complete set of surface treatment equipment for high-density semiconductor substrates Complete set of prototype plating equipment compatible with various surface treatments Complete set of pure water supply system Complete set of pure water washing specification drying machine system Complete set of X-ray film thickness measurement equipment Complete set of fully automatic drainage treatment system with total filtration