テクノイースト Company Overview

High-level electroless bonding

Plating processing of printed circuit boards Development of surface treatment processes Support for special substrates to high multilayer and large substrates Main equipment Complete set of bonding gold plating equipment Complete set of surface treatment equipment for high-density semiconductor substrates Complete set of prototype plating equipment compatible with various surface treatments Complete set of pure water supply system Complete set of pure water washing specification drying machine system Complete set of X-ray film thickness measurement equipment Complete set of fully automatic drainage treatment system with total filtration