Developing cutting-edge plating in panel copper plating, electroless gold plating, and electrolytic gold plating for printed circuit boards.
In addition to the high demand for advanced surface treatment technologies from product development sites for cutting-edge technologies such as computers and related devices, communication and mobile devices, gaming consoles, and various digital home appliances, there is a continuing expansion in the demand for printed circuit boards for vehicles and onboard devices, often referred to as moving computers. We are particularly committed to establishing cutting-edge equipment and production systems, as well as enhancing engineers' skills, to ensure stable quality, flexible specification support, and speedy mass production technology.
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basic information
【Features】 ○ Established industry-leading thick gold plating technology. ○ Established mass production technology for rigid substrates and BVH substrates with a thickness of 0.06mm. ○ Fully committed to strengthening cutting-edge equipment, production systems, and engineer skills to establish speedy mass production technology. ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Applications】 ○ Panel copper plating ○ Electroless gold plating ○ Electrolytic gold plating ● For other functions and details, please contact us.
Company information
As a pioneer in the industry with non-electrolytic gold plating technology, we take pride in our top-level coating characteristics and have received high praise for our high-quality mass production technology for copper through-hole substrates. We operate with a high level of comprehensive strength from research and analysis to technology development, production management, mass production, inspection, and shipping. By establishing a real-time management network system, each department approaches its tasks with flexibility, speed, and a quality-first mindset.
