This is a manual CMP device compatible with φ300 wafers. It is ideal for MEMS, TSV, and thin processing.
It is ideal for film processing (CMP) of silicon wafers and thin plate processing. There are devices compatible with Low-K films, conductors, and insulating films. Thin plate processing of wafer materials can also be performed separately with an optional device, allowing for the separation of wafers as thin as 30μm and 50μm.
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basic information
【Features】 ○ Silicon wafer film processing (CMP) ○ Thin plate processing ○ Film types include equipment for Low-K films, conductive films, and insulating films ● For more details, please contact us.
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With the arrival of a rapidly information-oriented society, the needs of society have become more diverse, and higher functionality and quality products are being demanded across all industries. In this context, we at Technorise have not forgotten our high goal of "providing precision that exceeds standards," which has been our motto since our establishment. We have engaged in various technological developments across a range of devices and have provided products based on solid trust. Thanks to this, we have received high evaluations from customers in various fields, and we have gained significant trust for a wide array of products, including wrapping and polishing-related equipment, semiconductor-related devices, flat and spherical polishing machines, various tools, as well as silicon wafers, environmental products, and optical communication-related devices. As we enter the 21st century, expectations for ultra-high technology are increasing, and at the same time, there are still many challenges that companies will face, such as addressing environmental issues, reducing all costs, and improving business efficiency. Technorise aims to continue proposing better products and contributing to society in various ways.
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