You can monitor the COF (friction coefficient), pad surface temperature, polishing liquid temperature, and room temperature inside the device.
【Tribo】 - Compatible with 400mm diameter polishing plates - 100mm/4-inch polishing head x2 axes - Two slurry pumps, compatible with acidic slurries - Supports industry-standard In-Situ diamond conditioning - Controlled by a built-in touch panel PC 【Orbis】 - Compatible with 600mm diameter polishing plates - 200mm/8-inch polishing head x2 axes - Two slurry pumps, compatible with acidic slurries *Equipped with two types of slurries - Supports industry-standard In-Situ diamond conditioning - Controlled by a built-in touch panel PC
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【Orbis】 Plate speed: 0-160rpm Plate diameter: 600mm Plate rotation: Clockwise and counterclockwise Carrier 1 speed: 10-125rpm Carrier 2 speed: 10-125rpm Available carrier sizes: 100mm (4 inches), 150mm (6 inches), 200mm (8 inches) wafers Height: 1950mm Depth: 735mm to 785mm (including front bar) Width: 1680mm + control arm (flat 180mm) Net weight: 590kg Total packaged weight: 830kg Chemical compatibility: Acidic and alkaline CMP slurries 【Tribo】 Plate speed: 0-100rpm Plate diameter: 400mm Plate rotation: Clockwise and counterclockwise Carrier 1 speed: 10-100rpm Carrier 2 speed: 10-100rpm Available carrier size: 100mm (4 inches) wafer Height: 1123mm Depth: 885mm to 985mm (including screen) Width: 1234mm to 1382mm (including pipes) Net weight: 260kg Total packaged weight: 440kg Chemical compatibility: Acidic and alkaline CMP slurries
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【Process Control】 All parameters can be set via a touch panel. The switching of slurries is also automatic. During polishing, multiple process parameters can be monitored, and data can be saved and output for analysis. The parameters that can be monitored and saved are as follows: - Friction coefficient - Pad temperature - Slurry temperature (both supply side and waste side) *Acidic slurries can also be used - Ambient temperature 【Wafer Carrier Head】 - Lightweight design with a special mechanism for easy removal - Template compatible with all wafer sizes (including chips) - Three types of carrier heads for Orbis (4, 6, 8 inches) 【Shape Control (Back Pressure)】 - Back pressure (0–50 psi) to control uneven shapes - Wafer warping can be polished uniformly with back pressure - Using Logic Tech's interferometer (GI20), it is possible to adjust the wafer shape more precisely.
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