Innovation supplier for wafer transport and FPD panel transport.
Manual tweezers for handling ultra-thin wafers, stress-free on wafers, compatible with small to large diameters, and accessible for wafer cassettes.
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【Features】 ○ Manual tweezers for handling ultra-thin wafers ○ Stress-free for wafers ○ Compatible with small to large diameters ○ Access to wafer cassettes ● For more details, please contact us.
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Providing total solutions for ultra-thin wafer transport equipment. Contributing to reduced defect rates and improved takt time through non-contact wafer transport. Enabling the transport of perforated wafers such as TSV (Through Silicon Vias) wafers and MEMS wafers. Supporting the transport of new process wafers such as TAIKO wafers and DBG wafers, as well as the transport of thin wafers requiring backside processing for power devices (Wf surface access).