株式会社ハーモテック Company Overview

Our company is solving many problems and proposing new transportation concepts through our unique patented technology.

Providing total solutions for ultra-thin wafer transport equipment. Contributing to reduced defect rates and improved takt time through non-contact wafer transport. Enabling the transport of perforated wafers such as TSV (Through Silicon Vias) wafers and MEMS wafers. Supporting the transport of new process wafers such as TAIKO wafers and DBG wafers, as well as the transport of thin wafers requiring backside processing for power devices (Wf surface access).