Innovation supplier for wafer transport and FPD panel transport.
Elimination of static electricity and peeling charge, centering during transport to reduce equipment takt time.
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basic information
【Features】 ○ Stress-free handling of ultra-thin wafers ○ Elimination of breakage and cracks during the transport of ultra-thin wafers ○ Compatible with coin stack-type transport cases ○ Elimination of particle transfer to wafers ○ Loading access to the wafer surface is possible ● Please contact us for more details.
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Company information
Providing total solutions for ultra-thin wafer transport equipment. Contributing to reduced defect rates and improved takt time through non-contact wafer transport. Enabling the transport of perforated wafers such as TSV (Through Silicon Vias) wafers and MEMS wafers. Supporting the transport of new process wafers such as TAIKO wafers and DBG wafers, as well as the transport of thin wafers requiring backside processing for power devices (Wf surface access).
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