Innovation supplier for wafer transport and FPD panel transport.
The conventional KUMADE CUP type was optimally designed to safely and reliably transport ultra-thin semiconductor wafers (thickness below 50μm). The newly developed KUMADE CUP type maximizes the potential of swirling flow for transporting solar cell/FPD substrates. It achieves high-speed transport of crystalline silicon solar cells with a consumption flow rate of just 15L/min.
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basic information
【Features】 ○ Follows high-speed transport ○ Ideal for crystalline Si solar cells, which will become thinner in the future ○ Performance improvement of over 200% compared to conventional products ○ Compatible with heavy and large glass substrates for thin-film Si and compound systems ○ CO2 emissions reduced by up to approximately 90%! Please use it for environmental goals ● For more details, please contact us.
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Providing total solutions for ultra-thin wafer transport equipment. Contributing to reduced defect rates and improved takt time through non-contact wafer transport. Enabling the transport of perforated wafers such as TSV (Through Silicon Vias) wafers and MEMS wafers. Supporting the transport of new process wafers such as TAIKO wafers and DBG wafers, as well as the transport of thin wafers requiring backside processing for power devices (Wf surface access).
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