Last Updated： Aggregation Period:Jun 17, 2026～Jul 14, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jun 17, 2026～Jul 14, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jun 17, 2026～Jul 14, 2026
This ranking is based on the number of page views on our site.
1～30 item / All 535 items
Automatic transportation to hoppers such as measuring filling machines. No manual labor required.
It addresses issues such as the inconvenience of replenishing materials due to the high position of the filling machine hopper, and the need for frequent feeding operations due to the small capacity of the filling machine hopper.
We will respond to our customers' needs with a consistent engineering system!
Our company engages in engineering and equipment manufacturing for civilian facilities in sectors such as automotive, electronics, chemicals, steelmaking, metal processing, food, and healthcare, focusing on labor-saving, manpower reduction, resource conservation, and unmanned automation, as well as processing aerospace-related components. To achieve advanced "FA (Factory Automation)," we have a full-range engineering system that covers everything from consulting to design and manufacturing, installation, and maintenance, allowing us to respond accurately to our customers' needs.
![[Production Example] Special Light Irradiation Conveying Device](https://image.mono.ipros.com/public/product/image/014/2000592450/IPROS08858567035054253758.png?w=280&h=280)
Production of devices that do not neglect control! We will introduce a case study on the design and production of a special transport device for illuminating the entire workpiece.
At iSystem, we manufacture "special light irradiation transport devices." We designed and produced this device in response to customer requests to irradiate special light onto objects on a pallet. By rotating the transported items on the conveyor lane, it is possible to illuminate the entire surface. For details on the movement, please watch the video below. *The object on the pallet in the video is an illustration to convey the rotation motion. With our extensive experience and knowledge, we will provide a design that meets your satisfaction, so please feel free to contact us. *For more details, please do not hesitate to inquire.
![[Production Example] Rack Transport Equipment for Medical Device Cleaning Machines](https://image.mono.ipros.com/public/product/image/0c6/2000857198/IPROS65811736506505699216.png?w=280&h=280)
Connect the clean side and the dirty side! Achieve a layout that circulates.
We would like to introduce a case where we manufactured a "rack transport system for medical equipment cleaning machines." This layout connects the clean side and the dirty side, allowing for circulation. It is a transport device for delivering and stocking racks to the cleaning machine used for washing medical instruments. It combines a manual turntable with an automatic linear conveyor. [Case Overview] ■ Model Name: Cage Transport Stacker ■ Transports and stocks racks to the cleaning machine ■ Combines a manual turntable with an automatic linear conveyor ■ Layout designed for circulation *For more details, please refer to the related links or feel free to contact us.
Parts Transport Super Machine
● Comfortable workplace achieved due to low noise ● No external rotating mechanisms, ensuring safety ● Vertical transport (up to 2.5m) ● Reduction of poor working postures ● Can be discharged from cleaning solution (only for fixed hopper SFB type) ● The rotating hopper type (SRB type) eliminates "entanglement" of transported items.
Smoothly and easily transporting long bolts vertically.
■Vertical transport (can handle extraction heights up to 1.7m), thus saving space ■The work entry point is low, reducing poor working postures ■The feeding chute is equipped with an "entanglement prevention mechanism" for transported items ■Safety is ensured with a transparent cover, making maintenance easy ■No moving parts are exposed externally, ensuring safety
Diverse mounting hole patterns for the carrier! Equipped with a roller guide system.
We would like to introduce our 1-axis transport device (Y) 'EP'. With rack and pinion drive, the repeat positioning accuracy is ±0.02mm, and you can freely attach the desired interface. Please feel free to consult us when you need assistance. 【Features】 ■ Diverse mounting hole patterns for the carrier ■ Repeat positioning accuracy ±0.02mm ■ Freely attachable desired interface ■ Rack and pinion drive ■ Roller guide system *For more details, please refer to the PDF document or feel free to contact us.
A structure that combines precision and rigidity! With rack and pinion drive, the repeat positioning accuracy is ±0.02mm.
We would like to introduce our 3-axis transport device (X/Y/Z) 'FP'. Based on the ZP series, the horizontal axis movement range has been expanded. It features a high-load roller guide system, providing a vast stroke range that can replace industrial robots. It can accommodate a load capacity of up to 3,125 kg and has a structure that combines precision and rigidity. Please feel free to consult us when you need assistance. 【Features】 ■ Rack and pinion drive ■ High-load roller guide system ■ Maximum load capacity of 3,125 kg ■ Repeat positioning accuracy of ±0.02 mm ■ Expanded horizontal axis movement range based on the ZP series ■ Vast stroke range that can replace industrial robots ■ Structure that combines precision and rigidity *For more details, please refer to the PDF document or feel free to contact us.
Pursuing ultra-precision and mechatronics. A mechatronics manufacturer that opens up tomorrow with diverse technologies.
Our company, guided by the philosophy of "pursuing ultra-precision and mechatronics," is a mechatronics manufacturer that opens up the future with diverse technologies in logistics material handling systems, industrial machinery, electric discharge machines, and machine tools. Our products contribute to improving productivity, streamlining logistics, enhancing efficiency, reducing labor, and automating processes across a wide range of fields, including automotive, electronics, precision machinery, molds, petrochemicals, food, civil engineering, and shipbuilding, earning us significant patronage from customers both domestically and internationally. 【Business Areas】 ○ Material Handling Division ○ Industrial Machinery Division ○ Precision Machinery Division For more details, please contact us or download our catalog.
Non-contact suspension transport of workpieces using air jets! Bernoulli chuck.
The new mechanism adopts the "vertical gas jet method." This method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction losses of the gas flow within the chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved stability of the holding mechanism, increased resistance to shocks, and nearly halving the gas consumption. The "float chuck" generates negative pressure through the ejector effect and Bernoulli effect by ejecting gas, as well as positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in a non-contact state while floating in the air, enabling transportation, inversion, and tilting.
Laminating substrates, films, and FPCs with high speed and precision.
The film that has been sent is accurately aligned and accumulated in a non-contact manner. This device consists of a holding mechanism called "Float Chuck," which was developed by our company, that suspends the deflection plate, FPC, and film in a non-contact state by blowing air to keep them floating in the air. It also employs a "non-contact support running device" that moves in synchronization with the work progression. It reliably and accurately accumulates thin and flexible workpieces at high speed without causing dirt adhesion or damage.
Non-contact, high-speed, and precise stacking of the sent bias plates, films, and sheets.
1. Features a. Stacking and layering without contact b. Does not cause scratches or dirt on the film c. High speed e. Clean 2. Applications a. Polarizing plates b. FPC (Flexible Printed Circuit) c. Plastic sheets d. Bright metallic sheets
Tweezers that grasp wafers non-contactly by manual operation.
The wafer is grasped and transported non-contact through manual operation. There are no scratches, dirt, or damage.
A robotic hand that inserts and removes wafers to and from a carrier without contact.
Wafers can be transported non-contact. The thin hand allows for the insertion and removal of wafers to and from the carrier. Usable in a clean room. Alignment is possible.
High-speed supply of stacked breathable sheets, films, non-woven fabrics, and paper one by one using a non-contact transport device called "Float Chuck."
Breathable thin sheets. Compatible with film, non-woven fabric, and paper. Dispenses one sheet at a time. High speed.
Transporting micro lenses non-contact.
We will suspend and transport micro lenses for camera-equipped mobile phones, digital cameras, medical cameras, and industrial compact cameras in a non-contact state, floating in the air. No scratches or dirt will be attached.
Non-contact transport device for gripping ultra-thin warped wafers without touching them.
◎ Features 1. Non-contact handling and transport of ultra-thin warped wafers and plate-like bodies 2. Does not damage the wafer 3. Does not leave any dirt ◎ Applications 1. Warped wafers 2. GaSa wafers 3. Ultra-thin wafers 4. Surface-treated wafers
A device that sends out, transports, and stacks laminated films one by one.
◎Features 1. Sends out laminated films one by one. 2. Transports without the tip drooping. 3. Laminates with high precision. 4. Prevents scratches and dirt from adhering. 5. Does not apply stress. 6. Does not generate static electricity.
Holes in ceramic substrates and FPC substrates can be transferred non-contact regardless of the position of the holes.
1. Through-hole perforated boards and film substrates are suction-compatible. 2. Suction is possible regardless of the size of the substrate or the position of the holes. 3. Stacked substrates are suctioned one by one. 4. No need to change the setup of the suction device. 5. Does not leave scratches or dirt marks on the pads.
Send out, transport, and stack sheets using air flow.
The device is designed to stack sheets such as amorphous solar cells, polarizers, films, sheets, wafers, glass, and paper using a non-contact transport system called "Float Chuck" (patented), which feeds out the stacked sheets one by one while ensuring that no drooping occurs at the leading edge, allowing for precise stacking. In the film feeding section, an "air flow feeding mechanism" (patented) is employed to reliably feed out the films one by one. The transport section utilizes the "Float Chuck," enabling transport without causing drooping at the leading edge of the film during the process. This allows for defect inspection of film reflection and transmission using sensors. The stacking section consists of a "non-contact suspended conveyor" formed by the non-contact transport device "Float Chuck," which drops thin, flexible films in a horizontal state and stacks them accurately at high speed.
Non-contact robotic hand
By ejecting gas, it generates negative pressure through the ejector effect and Bernoulli effect, and positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in a non-contact state, enabling transport, inversion, and tilting. It is also referred to as a Bernoulli chuck. The exhaust recovery mechanism allows for use in ultra-clean rooms. It is compatible with semiconductor wafers, LCD/PDP glass substrates, printed circuit boards, ceramic substrates, films, paper, non-woven fabrics, ultra-thin workpieces, breathable workpieces, and more.
Film sheet conveying device
A chuck that holds and transports film, printed circuit boards, through-hole boards, paper, non-woven fabric, flexible sheets, and breathable sheets by ejecting gas.
Non-contact gripping of preform lenses, and loading and unloading into the press mold.
The "SRL Float Chuck PF Type" preform lens transfer device is a system that retrieves preform lenses from a press machine in a completely non-contact manner during the press molding process. By ejecting air, it generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure through the pressure chamber type air cushion effect and the airflow cushion effect, allowing the lens to be suspended and transported in a non-contact state while floating in the air. This non-contact loading and unloading device for preform lenses, "SRL Float Chuck PF Type," does not come into contact with the lens surface or the lens edge. As a result, it does not scratch or dirty the lens surface and side edges, and it also prevents dust generation.
Solar cell and solar wafer non-contact transport device
The solar cell solar wafers, silicon solar cells, amorphous solar cells, and thin-film solar cell cells are transported non-contact by blowing gas or air. A nozzle is equipped to ensure that the high-speed airflow emitted does not directly collide with the solar cells, and the mechanism prevents damage to the thin, fragile solar cells due to the high-speed airflow. Additionally, the "non-contact transport device for solar cell wafers" uses a small amount of air and is efficient. Furthermore, its structure does not discharge exhaust flow into the surrounding environment, thus preventing pollution.
Bernoulli chuck for non-contact gripping of 1.0mm x 1.0mm square wafer chips.
We have developed a non-contact transfer device for microchips, the "Float Chuck SA-□1.0 type," which handles micro wafer chips ranging from 1.0mm to 15mm without contact. This device generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure via a pressure-type air cushion, allowing small cut wafer chips to be suspended in the air in a non-contact state for handling and storage in trays. It is capable of transporting, flipping, and tilting the chips without contamination, damage, or pad marks. Features: 1. Capable of non-contact handling and storage of micro wafer chips ranging from 1 to 15mm in size. 2. Chips can be retrieved from the tray without contact. 3. No scratches or dirt will be attached to the chips. 4. No pad marks will be left on the chips.
Non-contact transport system for glass substrates
The newly developed "Float Chuck Type C" series further adds and maximizes the effects of inertial force. It adopts a new mechanism for the gas ejection system, significantly increasing the suspension capability compared to conventional technology, while reducing gas consumption by nearly half. As a result, it is being considered for use with heavy loads that were previously avoided due to air consumption issues, particularly for the 8th generation large glass substrates (2200mm x 2200mm) and PDP large glass substrates (2000mm x 2000mm) for non-contact transport. Additionally, the reduction in exhaust gas makes it suitable for use in clean rooms. It excels in holding stability, is resistant to impact, and does not put stress on glass substrates. It is also widely used for the non-contact transport of thin semiconductor wafers.
Non-woven fabric (automotive mat) transport device
Non-woven fabric (mat) for interior decoration is gripped and transported by air flow using the 'Non-woven Fabric Gripping and Transport Device.' It grips and transports ceiling materials, mats, and non-woven fabrics for interior use one by one to molding machines and presses. By ejecting air, it generates negative or positive pressure according to the gap with the non-woven fabric using a non-contact transport device called 'Float Chuck KF Type' (patented), which grips and transports the non-woven fabric. The non-contact transport device 'Float Chuck KF Type' can grip and transport breathable, thin, flexible, uneven, and fragile works without causing damage, which is impossible with vacuum suction.
Clean room compatible Bernoulli chuck that does not scatter debris.
The cleanroom-compatible "Bernoulli Chuck WAS type" efficiently suspends and transports workpieces in a non-contact state by ejecting gas. The "Bernoulli Chuck WAS type" is equipped with an exhaust recovery mechanism that captures the exhaust emitted from the nozzle, preventing the exhaust from leaking into the cleanroom. Therefore, it can be used for non-contact transport of wafers, glass substrates, and other items within the cleanroom.
Non-contact transport of ultra-thin glass substrates with a thickness of 50μm - Non-contact transport device "50μm Thick Ultra-Thin Glass Non-Contact Transport Device LNAS Type"
The non-contact suction mechanism of the "50μm thick ultra-thin glass non-contact transport device LNAS type" is equipped with a gas deflector directly below the air jet nozzle. The gas deflector redirects the high-pressure air flow ejected from the nozzle at a right angle, causing it to collide directly with the ultra-thin glass without damaging it. Therefore, as shown in the pressure distribution diagram, there is no localized stress applied to the ultra-thin glass by the high-pressure ejected air (it is in a negative pressure state). As a result, thin workpieces and fragile ultra-thin glass will not be damaged.
Bernoulli chuck for non-contact transfer of high-temperature workpieces.
This product is manufactured according to the usage environment temperature and chemical specifications. The quartz glass used in ultra-high temperature applications possesses numerous characteristics, such as high purity, resistance to heat and acid, and high mechanical strength. It has become possible to transport wafers non-contact in cleaning tanks, oxidation diffusion furnaces, etching devices, CVD devices, etc., in the semiconductor manufacturing process, as well as non-contact transport of glass molding lenses. Additionally, products are made to suit various environments, including aluminum, SUS, PEEK, and others. ◎ Features 1. Heat resistance up to 1000°C 2. Materials are selected based on the usage temperature environment. PTFE, PEEK, aluminum, SUS316, quartz, considering acidic, alkaline, and corrosive gases. ◎ Target Work 1. High-temperature wafers 2. Glass molded lenses and preforms 3. Compound semiconductor wafers 4. Glass substrates
