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  1. Home
  2. Electronic Components and Semiconductors
  3. ソーラーリサーチ研究所 大阪事業所
Electronic Components and Semiconductors
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ソーラーリサーチ研究所 大阪事業所

EstablishmentApril 1978
capital300Ten thousand
number of employees7
addressOsaka/Toyonaka-shi/2-7-14 Kitazakurazuka
phone06-6852-3876
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last updated:Dec 29, 2019
ソーラーリサーチ研究所logo
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  • Products/Services(68)
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ソーラーリサーチ研究所 Company Overview

Catch with air.

Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.

Business Activities

Manufacturing of non-contact transport devices and application devices for wafers, LCD glass, PDP, ceramics, printed circuit boards, FPC substrates, paper, fabric, etc., using the non-contact transport device "Float Chuck" (patented in-house development).

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Products/Services (68)

Non-contact transport device for heavy objects "Float Chuck SA-5C (SAN) type" product image
Non-contact transport device for heavy objects "Float Chuck SA-5C (SAN) type"
Concave/Convex Lens Universal Bernoulli Chuck Type W product image
Concave/Convex Lens Universal Bernoulli Chuck Type W
Super fine 1.4mm x 55mm ultra-thin long work Bernoulli chuck. product image
Super fine 1.4mm x 55mm ultra-thin long work Bernoulli chuck.
Small Bernoulli chuck for 5mm square wafers compatible with clean rooms. product image
Small Bernoulli chuck for 5mm square wafers compatible with clean rooms.

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news(5)

50μm ultra-thin glass non-contact transport device that transports 50μm ultra-thin glass without causing damage.

  • OTHER

The non-contact suction mechanism of the "50μm ultra-thin glass non-contact transport device" has the function of suspending and holding 50μm ultra-thin glass in a non-contact state by blowing air. A gas deflector is installed directly below the air blowing nozzle. The gas deflector redirects the high-pressure air flow ejected from the nozzle at a right angle, causing it to collide directly with the 50μm ultra-thin glass without damaging the extremely thin glass. It does not apply localized stress due to the high-pressure ejected air. Therefore, thin and fragile workpieces will not be damaged.

Jul 22, 2012

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sannsei3(1)1.jpg

Glass mold lens non-contact insertion and removal device

  • PRODUCT

The "Non-contact Insertion and Extraction Device for Glass Mold Lenses" consists of the following processes: 1. The process of moving the lens from the case to the positioning jig. 2. The process of inserting the positioned preform into the press mold. 3. The process of extracting the molded glass mold lens from the press mold. These processes are carried out non-contact without touching the glass mold lens. The "Non-contact Insertion and Extraction Device for Glass Mold Lenses" has a mechanism for generating negative pressure through ejector action and Bernoulli action by ejecting gas, as well as a positive pressure generation mechanism through pressure chamber air cushion action and gas flow cushioning action (patented), allowing the three processes to be performed non-contact with the glass mold lens.

Apr 20, 2012

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Air floating transport device that elevates and transports LCD glass substrates.

  • PRODUCT

The floating transport device "High Floater" (Pat.P) generates a constant pressure zone in a cushion chamber formed by the ejected air flow, allowing the seat to float high through the pressure chamber air cushion effect. Conventional air floating transport devices have the issue of high power consumption due to the need to eject pressurized air, and the floating height is less than 1 mm, which poses a risk of the seat contacting the device with only a slight gap during transfer between devices. The "High Floater" can elevate the seat significantly and uses low-pressure air, resulting in lower electricity consumption and cost-effectiveness. ◎ Applications - Transport of large LCD glass substrates - Transport of solar cells - Transport of films - Laser surface defect inspection devices - Camera surface defect inspection devices - Resistivity measurement devices - Surface defect inspection devices using sensors

Jan 02, 2011

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Detailed information

Company name ソーラーリサーチ研究所 大阪事業所
number of employees7
Contact addresspostalcode 560-0022 Osaka/ Toyonaka-shi/ 2-7-14 KitazakurazukaView on map TEL:06-6852-3876
Key PartnersMitsubishi Electric Sony Hitachi Asahi Glass Panasonic Sharp
Industry Electronic Components and Semiconductors

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