Through-hole board and FPC board transfer device
Non-contact chuck (for through-hole boards and FPC boards)
Holes in ceramic substrates and FPC substrates can be transferred non-contact regardless of the position of the holes.
1. Through-hole perforated boards and film substrates are suction-compatible. 2. Suction is possible regardless of the size of the substrate or the position of the holes. 3. Stacked substrates are suctioned one by one. 4. No need to change the setup of the suction device. 5. Does not leave scratches or dirt marks on the pads.
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basic information
Stacked printed circuit boards, through-hole boards, FPCs, films, and ceramic substrates are transported one by one without contact, regardless of hole positions or substrate sizes. By blowing gas toward the substrate, a negative pressure is generated by the Bernoulli effect, allowing for non-contact holding and transportation of the substrate. It is possible to adsorb substrates such as perforated boards, film boards, and ceramic boards regardless of their size or hole positions. Stacked substrates can be suction-transported one at a time.
Price information
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Price range
P3
Delivery Time
P4
Applications/Examples of results
Transport each stacked through-hole ceramic printed circuit board individually by suction. Transport each board non-contact, regardless of hole position or board size. Transport of ceramic substrates. Transport of flexible printed circuit boards.
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
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