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  1. Home
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  3. Manufacturing and processing machinery
  4. marking
  5. Laser marker
  6. HGTECH manufactured laser marking machine for circuit boards and laser cutting machine for circuit boards.

HGTECH manufactured laser marking machine for circuit boards and laser cutting machine for circuit boards.

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last updated:Aug 09, 2023

JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
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Overwhelming cost performance! Capable of simultaneous marking on both sides of the substrate! Short delivery time!

In our office, we handle laser devices manufactured by HGTECH, which offer overwhelming cost performance. The LCB series (double-sided type) and LCD series (single-sided type) laser marking machines for substrates can perform fine marking on various materials such as paper, resin, and metal, and support simultaneous processing on both sides with dual heads! We also offer the LBB series (inline machines) and LBA series (standalone machines) for substrate laser cutting, with the capability for short delivery times. 【Features】 ■ Substrate Laser Marker Model: LCB-10C - Supports fine marking with a size of 0.5mm - Easy software setup, capable of printing various codes - Can be equipped with a shutter for opening and closing sections and can be integrated with existing systems ■ Substrate Laser Cutting Machine Model: LBA-15U - Enables high-precision cutting with minimized damage 【Others】 - Proposals are also available in Japan, China, Thailand, Malaysia, and Vietnam. - Actual machine viewing and evaluation are possible in Japan, China, and Thailand. *If you are interested, please feel free to contact us through the "Contact Us" section. *For more details, please download the PDF or feel free to reach out to us.

    Circuit board processing machineLaser markerOther markings
レーザー製品全般トップ画像.PNG

HGTECH manufactured laser marking machine for circuit boards and laser cutting machine for circuit boards.

レーザー製品全般トップ画像.PNG
レーザー製品全般トップ画像.PNG 黒基板サンプル.JPG 青基板サンプル.JPG 白プリント基板サンプル.JPG 白基板サンプル.JPG 緑基板サンプル.JPG 基板サンプル9.JPG 基板サンプル10.JPG
  • Related Link - https://www.jfe-shoji-ele.co.jp/business/smt/

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【LCB-10C Specifications】 Laser Source: CO2, Fiber, UV, Green Average Output: 10W/20W Board Size: 50mm×50mm to 460mm×510mm Repeat Positioning Accuracy: ±0.1mm Minimum Irradiation Width: <0.15mm Readable Codes: Code128, Code39, EAN-8, DataMatrix, QR code, etc. Modules: X-axis/Y-axis Module Position Correction Function: CCD Camera External Device: Dust Collector Voltage: AC220V/50–60Hz/2.5KVA Operating Environment: Temperature 15–30℃, Humidity <50% Size: 1000mm(W)×1600mm(L)×1500mm(H) 【LBA-15U Specifications】 Laser Source: CO2/Fiber/UV/Green Average Output: 12W/15W/20W/40W Irradiation Accuracy: ±0.01mm Board Size: 435mm×335mm Minimum Irradiation Width: 20μm CCD Positioning Accuracy: 3μm Repeat Positioning Accuracy: 3μm Board Thickness: <1mm Voltage: AC220V/50Hz-60Hz/4.0KVA Size: 1,300mm(W)×1,050mm(L)×1,700mm(H)

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Substrate Laser Marker "LCB-10C"

Substrate Laser Marker "LCB-10C"

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Substrate Laser Cutter "LBA-15U"

Substrate Laser Cutter "LBA-15U"

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Company information

JFE商事エレクトロニクス

JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室

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In this department, we provide total solutions for assembly by offering a diverse range of products and high technical capabilities to meet the challenges of our customers, who are globally expanding primarily in China, Thailand, Malaysia, and Vietnam. We focus on excellent assembly equipment from Panasonic Connect (formerly Panasonic Smart Factory Solutions) to support high performance, miniaturization, and lightweight electronics products, as well as peripheral equipment, technical support, and maintenance. Please take a look at our introduction video. https://www.youtube.com/watch?v=efdEd2BVT-A

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