Micro wafer chip non-contact chuck

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Non-contact chuck for micro wafer chips "Float Chuck SA-□1.0mm type"

last updated：May 07, 2020

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Bernoulli chuck for non-contact gripping of 1.0mm x 1.0mm square wafer chips.

We have developed a non-contact transfer device for microchips, the "Float Chuck SA-□1.0 type," which handles micro wafer chips ranging from 1.0mm to 15mm without contact. This device generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure via a pressure-type air cushion, allowing small cut wafer chips to be suspended in the air in a non-contact state for handling and storage in trays. It is capable of transporting, flipping, and tilting the chips without contamination, damage, or pad marks. Features: 1. Capable of non-contact handling and storage of micro wafer chips ranging from 1 to 15mm in size. 2. Chips can be retrieved from the tray without contact. 3. No scratches or dirt will be attached to the chips. 4. No pad marks will be left on the chips.

Related Link - http://www.solarlab.co.jp/chip

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basic information

We have developed a "Micro Chip Non-Contact Transfer Device 'Float Chuck SA-□1.0' for handling and transporting wafer chips of sizes ranging from □1mm to □15mm without contact. This device generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure through a pressure-type air cushion effect, allowing small cut wafer chips to be suspended in mid-air in a non-contact state and stored in a tray. It is capable of transporting, flipping, and tilting the chips without contamination, damage, or pad marks. Features: 1. Capable of suspending and handling micro wafer chips of sizes □1 to □15mm without contact and storing them in a tray. 2. Chips can be retrieved from the tray without contact. 3. No scratches or dirt will be attached to the chips. 4. No pad marks will be left on the chips.

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Applications/Examples of results

We have developed a "Wafer Chip Non-Contact Collet Chuck" that can non-contact grip and transport micro work wafer chips ranging from 1mm² to 15mm². This device generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure through a pressure-type air cushion effect, allowing small cut wafer chips to be suspended in a non-contact state and stored in a tray. It is capable of transporting, flipping, and tilting without contamination, damage, or pad marks. **Features** 1. Capable of non-contact suspended gripping, storing in a tray, and handling of micro wafer chips from 1mm² to 15mm². 2. Chips can be removed from the tray non-contact. 3. No scratches or dirt will be attached to the chips. 4. No pad marks will be left on the chips.