2.0mm wafer chip non-contact chuck
Microscale 2.0mm wafer chip non-contact transfer device
It grips a micro 2.0mm IC wafer chip non-contact.
The "Micro 2.0mm Wafer Chip Non-Contact Chuck" generates negative and positive pressure in the gap between the mu chip and the cushion chamber created on the bottom surface by ejecting gas, allowing for the non-contact gripping and transport of micro 2.0mm square IC mu chips. During chip suction, maintaining parallelism between the working surface and the chip is operationally difficult due to the small gap, so this device is designed with a gas ejection nozzle that efficiently generates negative pressure in the small cushion chamber. ◎ Features 1. Capable of non-contact chucking of 2.0mm chips. 2. Non-contact transport of diced wafer chips. 3. Non-contact retrieval of chips from trays. 4. Non-contact holding allows for flipping and tilting of the chip. ◎ Applications 1. Embedded tag IC chips. 2. Event personnel management tag IC chips. 3. Fine wafer chips. 4. Micro lenses. 5. Micro optical devices.
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basic information
The "□2.0mm wafer non-contact chuck" generates negative and positive pressure in the gap between the cushion chamber created by the gas ejection and the working surface facing the chip, allowing it to attract and hold a 2.0mm square IC wafer chip in a non-contact state. During chip suction, maintaining parallelism between the working surface and the chip is operationally difficult due to the small gap, so this device is designed with a gas ejection nozzle that efficiently generates negative pressure in a tiny cushion chamber. ◎ Features 1. Capable of non-contact chucking of □2.0mm chips. 2. Transports diced wafer chips in a non-contact manner. 3. Allows for non-contact retrieval of chips from trays. 4. Enables inversion and tilting of chips held in a non-contact manner. ◎ Applications 1. Embedded tag IC chips. 2. Event personnel management tag IC chips. 3. Fine wafer chips. 4. Micro lenses. 5. Micro optical devices.
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Applications/Examples of results
The wafer chips, which are 2.0mm square and diced from the wafer, are chucked non-contact and transported and stored in trays, etc. Additionally, the wafer chips in the trays are retrieved and transported non-contact.
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
![[Information] How to Remove and Install a PP Chuck](https://image.mono.ipros.com/public/product/image/0c9/2000451247/IPROS86382377341383020411.jpeg?w=280&h=280)
