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  4. Semiconductor Manufacturing Equipment
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  6. Gas vertical jet method "non-contact chuck"

Gas vertical jet method "non-contact chuck"

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Non-contact transfer device "Float Chuck SA (SAN) type"

last updated:Apr 15, 2021

ソーラーリサーチ研究所 大阪事業所
ソーラーリサーチ研究所 大阪事業所
  • Official site

Catch with air.

●Suction and holding for transport without contact. ●No scratches, dirt, or pad marks will be left. ●Can be used in a clean room. ●Compatible with breathable workpieces, perforated workpieces, and ultra-thin flexible workpieces. ●Can also be used manually.

    WaferlensOther semiconductor manufacturing equipment
wa-2cMac-tec.jpg

Gas vertical jet method "non-contact chuck"

wa-2cMac-tec.jpg
wa-2cMac-tec.jpg
  • Related Link - http://www.solarlab.co.jp/sac1

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basic information

The gas vertical jet flow type "non-contact chuck" float chuck SA (SAN) model (patented) holds and transports the workpiece in a non-contact state, suspended in the air, by ejecting gas. It can also be inverted or tilted. Additionally, it is equipped with an exhaust recovery mechanism, making it suitable for use in ultra-clean rooms. It can transport thin, breathable workpieces such as paper, film, non-woven fabric, and through-hole substrates. It is also referred to as a Bernoulli chuck. There are models that can be operated manually.

Price information

-

Delivery Time

P4

Applications/Examples of results

Wafer, glass substrate, lens, printed circuit board and through-hole board, non-woven fabric and paper, FPC, film transport process.

Company information

ソーラーリサーチ研究所

ソーラーリサーチ研究所 大阪事業所

Electronic Components and Semiconductors

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Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.

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