Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.
16～30 item / All 688 items
High-speed supply of stacked breathable sheets, films, non-woven fabrics, and paper one by one using a non-contact transport device called "Float Chuck."
Breathable thin sheets. Compatible with film, non-woven fabric, and paper. Dispenses one sheet at a time. High speed.
Transporting micro lenses non-contact.
We will suspend and transport micro lenses for camera-equipped mobile phones, digital cameras, medical cameras, and industrial compact cameras in a non-contact state, floating in the air. No scratches or dirt will be attached.
Non-contact transport device for gripping ultra-thin warped wafers without touching them.
◎ Features 1. Non-contact handling and transport of ultra-thin warped wafers and plate-like bodies 2. Does not damage the wafer 3. Does not leave any dirt ◎ Applications 1. Warped wafers 2. GaSa wafers 3. Ultra-thin wafers 4. Surface-treated wafers
A device that sends out, transports, and stacks laminated films one by one.
◎Features 1. Sends out laminated films one by one. 2. Transports without the tip drooping. 3. Laminates with high precision. 4. Prevents scratches and dirt from adhering. 5. Does not apply stress. 6. Does not generate static electricity.
Holes in ceramic substrates and FPC substrates can be transferred non-contact regardless of the position of the holes.
1. Through-hole perforated boards and film substrates are suction-compatible. 2. Suction is possible regardless of the size of the substrate or the position of the holes. 3. Stacked substrates are suctioned one by one. 4. No need to change the setup of the suction device. 5. Does not leave scratches or dirt marks on the pads.
Send out, transport, and stack sheets using air flow.
The device is designed to stack sheets such as amorphous solar cells, polarizers, films, sheets, wafers, glass, and paper using a non-contact transport system called "Float Chuck" (patented), which feeds out the stacked sheets one by one while ensuring that no drooping occurs at the leading edge, allowing for precise stacking. In the film feeding section, an "air flow feeding mechanism" (patented) is employed to reliably feed out the films one by one. The transport section utilizes the "Float Chuck," enabling transport without causing drooping at the leading edge of the film during the process. This allows for defect inspection of film reflection and transmission using sensors. The stacking section consists of a "non-contact suspended conveyor" formed by the non-contact transport device "Float Chuck," which drops thin, flexible films in a horizontal state and stacks them accurately at high speed.
Non-contact robotic hand
By ejecting gas, it generates negative pressure through the ejector effect and Bernoulli effect, and positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in a non-contact state, enabling transport, inversion, and tilting. It is also referred to as a Bernoulli chuck. The exhaust recovery mechanism allows for use in ultra-clean rooms. It is compatible with semiconductor wafers, LCD/PDP glass substrates, printed circuit boards, ceramic substrates, films, paper, non-woven fabrics, ultra-thin workpieces, breathable workpieces, and more.
Film sheet conveying device
A chuck that holds and transports film, printed circuit boards, through-hole boards, paper, non-woven fabric, flexible sheets, and breathable sheets by ejecting gas.
Non-contact gripping of preform lenses, and loading and unloading into the press mold.
The "SRL Float Chuck PF Type" preform lens transfer device is a system that retrieves preform lenses from a press machine in a completely non-contact manner during the press molding process. By ejecting air, it generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure through the pressure chamber type air cushion effect and the airflow cushion effect, allowing the lens to be suspended and transported in a non-contact state while floating in the air. This non-contact loading and unloading device for preform lenses, "SRL Float Chuck PF Type," does not come into contact with the lens surface or the lens edge. As a result, it does not scratch or dirty the lens surface and side edges, and it also prevents dust generation.
Solar cell and solar wafer non-contact transport device
The solar cell solar wafers, silicon solar cells, amorphous solar cells, and thin-film solar cell cells are transported non-contact by blowing gas or air. A nozzle is equipped to ensure that the high-speed airflow emitted does not directly collide with the solar cells, and the mechanism prevents damage to the thin, fragile solar cells due to the high-speed airflow. Additionally, the "non-contact transport device for solar cell wafers" uses a small amount of air and is efficient. Furthermore, its structure does not discharge exhaust flow into the surrounding environment, thus preventing pollution.
Bernoulli chuck for non-contact gripping of 1.0mm x 1.0mm square wafer chips.
We have developed a non-contact transfer device for microchips, the "Float Chuck SA-□1.0 type," which handles micro wafer chips ranging from 1.0mm to 15mm without contact. This device generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure via a pressure-type air cushion, allowing small cut wafer chips to be suspended in the air in a non-contact state for handling and storage in trays. It is capable of transporting, flipping, and tilting the chips without contamination, damage, or pad marks. Features: 1. Capable of non-contact handling and storage of micro wafer chips ranging from 1 to 15mm in size. 2. Chips can be retrieved from the tray without contact. 3. No scratches or dirt will be attached to the chips. 4. No pad marks will be left on the chips.
Non-contact transport system for glass substrates
The newly developed "Float Chuck Type C" series further adds and maximizes the effects of inertial force. It adopts a new mechanism for the gas ejection system, significantly increasing the suspension capability compared to conventional technology, while reducing gas consumption by nearly half. As a result, it is being considered for use with heavy loads that were previously avoided due to air consumption issues, particularly for the 8th generation large glass substrates (2200mm x 2200mm) and PDP large glass substrates (2000mm x 2000mm) for non-contact transport. Additionally, the reduction in exhaust gas makes it suitable for use in clean rooms. It excels in holding stability, is resistant to impact, and does not put stress on glass substrates. It is also widely used for the non-contact transport of thin semiconductor wafers.
Non-woven fabric (automotive mat) transport device
Non-woven fabric (mat) for interior decoration is gripped and transported by air flow using the 'Non-woven Fabric Gripping and Transport Device.' It grips and transports ceiling materials, mats, and non-woven fabrics for interior use one by one to molding machines and presses. By ejecting air, it generates negative or positive pressure according to the gap with the non-woven fabric using a non-contact transport device called 'Float Chuck KF Type' (patented), which grips and transports the non-woven fabric. The non-contact transport device 'Float Chuck KF Type' can grip and transport breathable, thin, flexible, uneven, and fragile works without causing damage, which is impossible with vacuum suction.
Clean room compatible Bernoulli chuck that does not scatter debris.
The cleanroom-compatible "Bernoulli Chuck WAS type" efficiently suspends and transports workpieces in a non-contact state by ejecting gas. The "Bernoulli Chuck WAS type" is equipped with an exhaust recovery mechanism that captures the exhaust emitted from the nozzle, preventing the exhaust from leaking into the cleanroom. Therefore, it can be used for non-contact transport of wafers, glass substrates, and other items within the cleanroom.
Non-contact transport of ultra-thin glass substrates with a thickness of 50μm - Non-contact transport device "50μm Thick Ultra-Thin Glass Non-Contact Transport Device LNAS Type"
The non-contact suction mechanism of the "50μm thick ultra-thin glass non-contact transport device LNAS type" is equipped with a gas deflector directly below the air jet nozzle. The gas deflector redirects the high-pressure air flow ejected from the nozzle at a right angle, causing it to collide directly with the ultra-thin glass without damaging it. Therefore, as shown in the pressure distribution diagram, there is no localized stress applied to the ultra-thin glass by the high-pressure ejected air (it is in a negative pressure state). As a result, thin workpieces and fragile ultra-thin glass will not be damaged.
