1～15 item / All 17 items
Film sheet conveying device
A chuck that holds and transports film, printed circuit boards, through-hole boards, paper, non-woven fabric, flexible sheets, and breathable sheets by ejecting gas.
Solar cell and solar wafer non-contact transport device
The solar cell solar wafers, silicon solar cells, amorphous solar cells, and thin-film solar cell cells are transported non-contact by blowing gas or air. A nozzle is equipped to ensure that the high-speed airflow emitted does not directly collide with the solar cells, and the mechanism prevents damage to the thin, fragile solar cells due to the high-speed airflow. Additionally, the "non-contact transport device for solar cell wafers" uses a small amount of air and is efficient. Furthermore, its structure does not discharge exhaust flow into the surrounding environment, thus preventing pollution.
Non-woven fabric (automotive mat) transport device
Non-woven fabric (mat) for interior decoration is gripped and transported by air flow using the 'Non-woven Fabric Gripping and Transport Device.' It grips and transports ceiling materials, mats, and non-woven fabrics for interior use one by one to molding machines and presses. By ejecting air, it generates negative or positive pressure according to the gap with the non-woven fabric using a non-contact transport device called 'Float Chuck KF Type' (patented), which grips and transports the non-woven fabric. The non-contact transport device 'Float Chuck KF Type' can grip and transport breathable, thin, flexible, uneven, and fragile works without causing damage, which is impossible with vacuum suction.
Bernoulli chuck for non-contact transport of wafer chips, high-temperature wafers, lenses, and micro-objects.
The Bernoulli Chuck "Non-contact Transport Device for Microscopic Objects" has adopted a new vertical gas jet method. The vertical gas jet method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing the friction loss of the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capability compared to conventional models. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption. The "Non-contact Transport Device for Microscopic Objects" suspends and transports the workpiece in a non-contact state, floating in the air by ejecting air towards the substrate.
Transport green sheets, through-hole substrates, breathable sheets, and non-woven fabrics without contact.
The non-contact transport device "Float Chuck LNA-S type" suspends and transports ceramic green sheets, through-hole substrates, non-woven fabrics, and breathable sheets without contact by ejecting air. The non-contact transport device "Float Chuck LNA-S type" is equipped with a nozzle that has a mechanism preventing high-speed air flow from directly colliding with the workpiece, allowing for the transport of thin, fragile green sheets with a thickness of 120μm and ultra-thin glass substrates over 50μm in thickness without damage or breakage. Additionally, the non-contact transport device "Float Chuck LNA-S type" has low air consumption and is highly efficient. ◎ Features 1. Transports and handles ceramic green sheets without contact. 2. Capable of transporting through-hole and perforated sheets. 3. Does not damage or break thin ceramic green sheets with a thickness of 120μm. 4. Capable of transporting ceramic green sheets without damage. 5. Low air consumption. 6. Does not pollute the environment.
Bernoulli chuck capable of efficient non-contact transport even for heavy workloads.
The heavy object non-contact transport device (Float Chuck SA-5C(SAN) type) adopts a new gas vertical jet method. The gas vertical jet method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction loss of the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved holding stability, greater resistance to impact, and nearly halved gas consumption. New method: Explanation of the gas vertical jet method. The heavy object non-contact transport device (Float Chuck SA-5C(SAN) type) technology allows for the suspension and transport of substrates in a non-contact state by ejecting air towards the substrate, keeping it floating in the air. It is designed to handle high loads while achieving low air consumption.
Transport ultra-thin wafers with a thickness of 20μm by bending, warping, and without damage in a non-contact manner.
TAIKO wafers, ultra-thin wafers with a thickness of 20μm, and compound semiconductor wafers can be suspended and transported non-contact without damage. It does not cause stress on the wafers. Wafers with warping can also be suspended and transported non-contact without damage. The air consumption is very low, making it economical.
Transporting micro wafer chips and micro lenses non-contact.
It is non-contact. It is possible to transport small workpieces non-contact. There are no scratches or dirt attached. There is no damage.
Transport, stack, and send the film non-contact.
A device that non-contact feeds, transports, and laminates amorphous solar cells, polarizing plates, light guide plates, films, paper, and sheets. It employs a non-contact transport device called "Float Chuck" (patented), which transports films non-contact by blowing air. It does not allow scratches or dirt to adhere to the workpiece. It is also suitable for weak and fragile films.
10G glass substrate non-contact transport device
A non-contact transport device that holds and conveys workpieces in a suspended manner by ejecting gas. It employs a new mechanism for the gas ejection system, with the air ejection outlet positioned at a small angle relative to the workpiece. There is no deceleration of airflow velocity caused by friction losses due to wall contact of the airflow. The amount of negative pressure generated increases, and the efficiency of load generation improves. Compared to conventional technology, the suspension capability has significantly increased, and gas consumption has nearly halved. Therefore, it is adopted for the non-contact transport of large workpieces with high loads, particularly for the eighth generation large glass substrates (2200mm x 2200mm) used in LCDs, which had previously been avoided due to air consumption issues.
Amorphous solar cell transport device
The holding device is composed of a non-contact transport system called "Float Chuck" (patent), which suspends amorphous solar cells, silicon solar cells, polarizing plates, FPCs, and films in a non-contact state floating in the air by ejecting air. The device accurately feeds out stacked sheets of amorphous solar cells, polarizing plates, films, sheets, wafers, glass, paper, and other materials one by one using the non-contact transport system "Float Chuck" (patent). In the areas where the device interacts with the film, the non-contact transport system "Float Chuck" is used, ensuring that there are no scratches, dirt, stress, or static electricity adhesion.
Grip and transport FPC, through-hole boards, films, and breathable non-woven fabrics without causing damage.
It grips, chucks, and transports flexible materials such as film, amorphous solar cells, paper, green sheets, non-woven fabrics, breathable materials, foams, and soft bodies. By blowing air towards the workpiece, it generates negative pressure through the Bernoulli effect, allowing it to chuck, grip, transport, stack, and handle the workpiece in a non-contact state.
A Bernoulli chuck equipped with an exhaust recovery mechanism that reduces exhaust to the clean room, suitable for use in a clean room with a positioning mechanism.
1. Exhaust Recovery Mechanism: The cleanroom-compatible Bernoulli chuck "Float Chuck WAS type" is composed of an operating surface facing the wafer being held, a cushion chamber provided at the center of the operating surface, a nozzle located at the center of the cushion chamber, and a hood around the outer periphery of the operating surface. The high-speed air flow ejected from the nozzle flows into the gap between the operating surface and the wafer without contacting the walls of the cushion chamber or the wafer. The amount of negative pressure generated by the ejector effect in the cushion chamber also increases, allowing for efficient negative pressure generation. The exhaust air that passes through the gap between the operating surface and the wafer is captured by the surrounding hood and is drawn out through the exhaust port to a designated location. As a result, the high-speed air jet rarely flows into the cleanroom, preventing the discharge of debris and the lifting of dust. 2. Positioning Mechanism: The guide attached to the "Float Chuck WAS type" has a shape at the bottom end that contacts the outer peripheral touchable part of the held wafer, which regulates the free movement of the wafer. Therefore, positioning is possible even though the wafer is held non-contact.
The compound semiconductor wafers (GaAs, InP, GaP) are supplied through gas operation, and the wafers are non-contact suctioned and detached at a specified position.
◎Features 1. Non-contact transport of wafers at high temperatures of 450°C is possible. 2. Non-contact transport of the following notched compound semiconductor wafers (GaAs, InP, GaP) is possible. - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers
Adopting the gas vertical jet flow method (VGFS), the Bernoulli chuck "Float Chuck SAC type" series reduces friction loss in the gas flow.
The "Float Chuck SAC Type" series, which adopts the gas vertical jet flow system (VGFS) and reduces friction loss in the gas flow, has newly implemented this gas vertical jet flow method. The gas vertical jet flow method vertically jets the gas flow ejected from the nozzle into the cushion chamber, reducing friction loss in the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption.
