Wafer chip, microlens, high-temperature wafer, non-contact transport device for micro-objects.
Non-contact transport device for micro-objects "Float Chuck SA-CH type"
Bernoulli chuck for non-contact transport of wafer chips, high-temperature wafers, lenses, and micro-objects.
The Bernoulli Chuck "Non-contact Transport Device for Microscopic Objects" has adopted a new vertical gas jet method. The vertical gas jet method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing the friction loss of the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capability compared to conventional models. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption. The "Non-contact Transport Device for Microscopic Objects" suspends and transports the workpiece in a non-contact state, floating in the air by ejecting air towards the substrate.
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basic information
The "non-contact transport device for micro-objects" can suspend and transport a substrate in a non-contact state by blowing air towards the substrate, causing it to float in the air. When the gap between the operating surface and the workpiece is large, the gas ejection nozzle, cushion chamber, and the gap between the operating surface and the workpiece function as the nozzle, vacuum chamber, and diffuser of an ejector, respectively. As a result, a negative pressure is generated in the cushion chamber, pulling the workpiece closer. When the workpiece is drawn in and the gap with the operating surface decreases, the cushion chamber functions as a pressure chamber type air cushion (hovercraft), causing the pressure in the cushion chamber to rise sharply and separating the workpiece. This maintains the workpiece in a non-contact state suspended in the air at a distance that automatically keeps the balanced pressure in the cushion chamber between the operating surface and the workpiece. ◎ Applications 1. Fine wafer chips 2. Fine lenses 3. Preforms for molded lenses 4. High-temperature wafers 5. Hydrated soft contact lenses in the hydration process 6. Flexible films (biofilms)
Price range
P3
Delivery Time
Applications/Examples of results
◎Adaptation 1. Micro fine wafer chips 2. Micro fine lenses 3. Preform for molded lenses 4. High-temperature wafers 5. Hydrated soft contact lenses from the hydration process 6. Flexible film (biofilm)
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
![[Semiconductor/Class 100 Compatible] 100% Water-Free Air Nozzle](https://image.mono.ipros.com/public/product/image/2116982/IPROS15202438644694791694.png?w=280&h=280)
