Transport ultra-thin wafers with a thickness of 20μm by bending, warping, and without damage in a non-contact manner.
TAIKO wafers, ultra-thin wafers with a thickness of 20μm, and compound semiconductor wafers can be suspended and transported non-contact without damage. It does not cause stress on the wafers. Wafers with warping can also be suspended and transported non-contact without damage. The air consumption is very low, making it economical.
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basic information
TAIKO wafers, ultra-thin wafers (below 20μm) of compound semiconductors, are transported in a suspended manner without bending, warping, or generating stress, and without adhering scratches or dirt, in a non-contact manner. By ejecting gas vertically within a cushion chamber, a Bernoulli effect and ejector effect generate negative pressure, allowing the wafers to be held in a suspended state without contact.
Price information
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Applications/Examples of results
Ultra-thin wafers, non-contact transport and transfer of TAIKO wafers, loader and unloader for inspection equipment.
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
![[Demo Video] Conveyor Back Air Transport Demonstration](https://image.mono.ipros.com/public/product/image/2a2/2000671635/IPROS91532483352107238892.png?w=280&h=280)
![[Semiconductor/Class 100 Compatible] 100% Water-Free Air Nozzle](https://image.mono.ipros.com/public/product/image/2116982/IPROS15202438644694791694.png?w=280&h=280)
