Non-contact transport device for sapphire substrate wafers "Float Chuck WAS" type

A Bernoulli chuck equipped with an exhaust recovery mechanism that reduces exhaust to the clean room, suitable for use in a clean room with a positioning mechanism.

1. Exhaust Recovery Mechanism: The cleanroom-compatible Bernoulli chuck "Float Chuck WAS type" is composed of an operating surface facing the wafer being held, a cushion chamber provided at the center of the operating surface, a nozzle located at the center of the cushion chamber, and a hood around the outer periphery of the operating surface. The high-speed air flow ejected from the nozzle flows into the gap between the operating surface and the wafer without contacting the walls of the cushion chamber or the wafer. The amount of negative pressure generated by the ejector effect in the cushion chamber also increases, allowing for efficient negative pressure generation. The exhaust air that passes through the gap between the operating surface and the wafer is captured by the surrounding hood and is drawn out through the exhaust port to a designated location. As a result, the high-speed air jet rarely flows into the cleanroom, preventing the discharge of debris and the lifting of dust. 2. Positioning Mechanism: The guide attached to the "Float Chuck WAS type" has a shape at the bottom end that contacts the outer peripheral touchable part of the held wafer, which regulates the free movement of the wafer. Therefore, positioning is possible even though the wafer is held non-contact.

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