Non-contact transport device for compound semiconductor wafers "SAG (InP) type"
Bernoulli Chuck (for InP wafer) "Float Chuck SAG (InP) type"
The compound semiconductor wafers (GaAs, InP, GaP) are supplied through gas operation, and the wafers are non-contact suctioned and detached at a specified position.
◎Features 1. Non-contact transport of wafers at high temperatures of 450°C is possible. 2. Non-contact transport of the following notched compound semiconductor wafers (GaAs, InP, GaP) is possible. - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers
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basic information
The Bernoulli chuck "Float Chuck SAG (InP) type" performs ON-OFF operation of gas supply to high-temperature compound semiconductor wafers (GaAs, InP, GaP), allowing the compound semiconductor wafers (GaAs, InP, GaP) and InP wafers to be non-contact suctioned and detached at a predetermined position. The Bernoulli chuck "Float Chuck SAG (InP) type" creates a negative pressure inside by ejecting gas, depending on the distance to the wafer, utilizing the ejector effect and Bernoulli effect, while also generating positive pressure through the pressure chamber type air cushion effect and the cushioning effect of the gas flow, thereby having the function of non-contact suspension holding of the InP wafer.
Price range
P3
Delivery Time
※50 days
Applications/Examples of results
The high-temperature compound semiconductor wafers (GaAs, InP, GaP) on the CVD apparatus's susceptor are non-contact suctioned and transported to a designated position.
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
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