Non-contact transport device of the Solar Research Institute: Float Chuck SAC type
Float Chuck LNAS Type
Custom-made vertical gas jet non-contact transport device "Float Chuck SAC Type"
We will manufacture a custom-made "Bernoulli chuck - non-contact transport device" that adopts a new mechanism of the Bernoulli chuck "Float Chuck SAC type," which has the Bernoulli effect, ejector effect, and Coanda effect. The new mechanism: The non-contact transport device "Float Chuck SAC type" has been enhanced with the Coanda effect to increase the ejector effect that generates suction power. It is a high-efficiency, low gas consumption non-contact transport device that combines the Bernoulli effect. This new method employs the "vertical jet airflow method" with the Bernoulli chuck for the non-contact transport device.
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basic information
The non-contact transport device "Float Chuck SA-C (SAN) type" can suspend and transport workpieces in a non-contact state by ejecting air towards them. When the gap between the operating surface and the workpiece is large, the gas ejection nozzle, cushion chamber, and the gap between the operating surface and the workpiece function as the ejector nozzle, vacuum chamber, and diffuser, respectively. As a result, a negative pressure is generated in the cushion chamber, pulling the workpiece closer. When the workpiece is drawn in and the gap with the operating surface decreases, the cushion chamber functions as a pressure chamber type air cushion (hovercraft), causing the pressure in the cushion chamber to rise sharply and separating the workpiece. The distance between the operating surface and the workpiece, which automatically maintains a balanced pressure in the cushion chamber, allows the workpiece to be suspended in the air in a non-contact state.
Price range
P3
Delivery Time
Applications/Examples of results
Manufacturing of the following non-contact transport device "Float Chuck SAC Type": - Non-contact hand (Si wafers, compound semiconductor wafers, solar cell wafers, InP wafers, etc.) - Glass substrates (up to 10G) - 50μm thick glass - Wafer chips - Lenses - Non-contact tweezers - Non-woven fabric
Detailed information
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8G glass substrate non-contact transport device
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
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