10G glass substrate non-contact transport device
Large Glass Substrate Non-Contact Transport Device Model SA-C
10G glass substrate non-contact transport device
A non-contact transport device that holds and conveys workpieces in a suspended manner by ejecting gas. It employs a new mechanism for the gas ejection system, with the air ejection outlet positioned at a small angle relative to the workpiece. There is no deceleration of airflow velocity caused by friction losses due to wall contact of the airflow. The amount of negative pressure generated increases, and the efficiency of load generation improves. Compared to conventional technology, the suspension capability has significantly increased, and gas consumption has nearly halved. Therefore, it is adopted for the non-contact transport of large workpieces with high loads, particularly for the eighth generation large glass substrates (2200mm x 2200mm) used in LCDs, which had previously been avoided due to air consumption issues.
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basic information
A non-contact transport device that holds and transports workpieces in suspension without contact by ejecting gas. It adopts a new mechanism for the gas ejection system, with the air ejection outlet having a small angle relative to the workpiece. There is no deceleration of airflow velocity due to friction loss from wall contact of the airflow. The amount of negative pressure generated increases, and the efficiency of load generation improves. Compared to conventional technology, the suspension capability has significantly increased, and gas consumption has nearly halved. Therefore, it has been adopted for heavy workpieces that were previously avoided due to air consumption issues, particularly for the 8th generation large glass substrates (2200mm x 2200mm) used in LCDs.
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Applications/Examples of results
Non-contact transport of 8th generation glass substrate 2200mm x 2200mm
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
![[Semiconductor/Class 100 Compatible] 100% Water-Free Air Nozzle](https://image.mono.ipros.com/public/product/image/2116982/IPROS15202438644694791694.png?w=280&h=280)
