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  4. Semiconductor Manufacturing Equipment
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  6. VGFS Non-contact Transport Device "Float Chuck SAC Type"

VGFS Non-contact Transport Device "Float Chuck SAC Type"

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Float Chuck SAC Type

last updated:Feb 06, 2021

ソーラーリサーチ研究所 大阪事業所
ソーラーリサーチ研究所 大阪事業所
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Adopting the gas vertical jet flow method (VGFS), the Bernoulli chuck "Float Chuck SAC type" series reduces friction loss in the gas flow.

The "Float Chuck SAC Type" series, which adopts the gas vertical jet flow system (VGFS) and reduces friction loss in the gas flow, has newly implemented this gas vertical jet flow method. The gas vertical jet flow method vertically jets the gas flow ejected from the nozzle into the cushion chamber, reducing friction loss in the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption.

    Other machine elementsOther semiconductor manufacturing equipmentTransport and handling robots
P1000406.JPG

VGFS Non-contact Transport Device "Float Chuck SAC Type"

P1000406.JPG
P1000406.JPG
  • Related Link - http://www.solarlab.co.jp/hp5

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Achieving significantly high load capacity with low air consumption The Bernoulli chuck "Float Chuck SAC type" series adopts a new gas vertical jet flow system (VGFS). The gas vertical jet flow system allows the gas flow ejected from the nozzle to be directed vertically in the cushion chamber, reducing friction losses of the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capability compared to conventional types. This results in increased holding stability, improved shock resistance, and nearly halved gas consumption. Due to the efficient negative pressure generation and pressurization effects mentioned above, it achieves the number one ranking in high load capacity with low air consumption. (A) The performance of the "Float Chuck SAC type" series exhibits (B) a "swirling flow method" and (C) compared to conventional Bernoulli chucks, it demonstrates a remarkable suspension force of 2 to 6 times greater with the same supply air volume. The development of the gas vertical jet flow "Float Chuck SAC type" series enables non-contact transport of large and heavy workpieces, including the "10th generation large LCD glass substrates," which had been a concern due to high air consumption.

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Applications/Examples of results

8/10G LCD glass substrate non-contact transport device SEMI wafer non-contact transport device Solar cell wafer non-contact transport device Lens non-contact transport device Optical film non-contact transport device Wafer chip non-contact transport device Non-woven fabric transport Ceramic substrate supply device

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ソーラーリサーチ研究所

ソーラーリサーチ研究所 大阪事業所

Electronic Components and Semiconductors

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Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.

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