Ultra-thin curved plate non-contact chuck
Warped wafer non-contact transport device
Non-contact transport device for gripping ultra-thin warped wafers without touching them.
◎ Features 1. Non-contact handling and transport of ultra-thin warped wafers and plate-like bodies 2. Does not damage the wafer 3. Does not leave any dirt ◎ Applications 1. Warped wafers 2. GaSa wafers 3. Ultra-thin wafers 4. Surface-treated wafers
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basic information
We transport wafers with warping, such as GaAs wafers and ultra-thin wafers, without contact. The "ultra-thin warped plate non-contact chuck" suspends and holds the wafer without contact by ejecting gas. This device employs a newly developed gas ejection nozzle and discharge section (Pat. Pend.) that enables non-contact transport of warped wafers.
Price information
-
Delivery Time
P3
Applications/Examples of results
We transport wafers with warpage, such as GaAs wafers and ultra-thin wafers, without contact. The "non-contact transport device for warped wafers" holds the wafers in a suspended state without contact by ejecting gas. This device employs a newly developed gas ejection nozzle and discharge section (Pat. Pend.) that enables non-contact transport of warped wafers.
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
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