List of Heating equipment/furnace products
- classification：Heating equipment/furnace
1～45 item / All 4713 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
We provide comprehensive support from design to manufacturing and maintenance!
- Contract manufacturing
Intuitive operation and precise settings with a dial. Reliable electronic temperature controller supporting high-precision heating control and snow melting.
- Temperature and Humidity Control
- Thermometer
- Other heaters
A snow melting system that uses far-infrared radiation to melt snow! Easy installation on existing walls and poles. Reduces snow removal labor and keeps costs down.
- Other heaters
Meeting various environmental needs! Pursuing the ideal road heating based on half a century of achievements and trust!
- Other heaters
The transformer manufacturer Nikkodenki will exhibit at booth 3-29 at "JECA FAIR 2024, the 72nd Electrical Installation Industry Exhibition (May 29 (Wed) - 31 (Fri), 2024 at Tokyo Big Sight)!"
We are pleased to announce that our company will be exhibiting at the "JECA FAIR 2024, the 72nd Electrical Industry Exhibition," which will be held at Tokyo Big Sight from May 29 (Wednesday) to May 31 (Friday). We kindly invite you to visit our booth during this time, and we sincerely look forward to your attendance despite your busy schedule. Exhibition: "JECA FAIR 2024, the 72nd Electrical Industry Exhibition" (https://www.jecafair.jp/) Date: May 29 (Wednesday) to May 31 (Friday), 2024 Time: 10:00 AM to 5:00 PM (Opening at 10:30 AM on the first day and closing at 4:30 PM on the last day) Location: Tokyo Big Sight, Halls 1, 2, and 3 Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 Booth No.: 3-29 Nikko Electric Co., Ltd. Satellite Akiba Address: 4th Floor, Yuki Building, 23-2 Kanda Higashimatsushita-cho, Chiyoda-ku, Tokyo TEL: 03-3518-5050 FAX: 03-3518-5051
The panel is made of highly durable striped steel plate! It has a non-slip surface treatment!
- Other heaters
The transformer manufacturer Nikkodenki will exhibit at booth 3-29 at "JECA FAIR 2024, the 72nd Electrical Installation Industry Exhibition (May 29 (Wed) - 31 (Fri), 2024 at Tokyo Big Sight)!"
We are pleased to announce that our company will be exhibiting at the "JECA FAIR 2024, the 72nd Electrical Industry Exhibition," which will be held at Tokyo Big Sight from May 29 (Wednesday) to May 31 (Friday). We kindly invite you to visit our booth during this time, and we sincerely look forward to your attendance despite your busy schedule. Exhibition: "JECA FAIR 2024, the 72nd Electrical Industry Exhibition" (https://www.jecafair.jp/) Date: May 29 (Wednesday) to May 31 (Friday), 2024 Time: 10:00 AM to 5:00 PM (Opening at 10:30 AM on the first day and closing at 4:30 PM on the last day) Location: Tokyo Big Sight, Halls 1, 2, and 3 Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 Booth No.: 3-29 Nikko Electric Co., Ltd. Satellite Akiba Address: 4th Floor, Yuki Building, 23-2 Kanda Higashimatsushita-cho, Chiyoda-ku, Tokyo TEL: 03-3518-5050 FAX: 03-3518-5051
Snow removal measures for structures! The future snow melting system that melts snow with infrared radiation.
- Other heaters
The transformer manufacturer Nikkodenki will exhibit at booth 3-29 at "JECA FAIR 2024, the 72nd Electrical Installation Industry Exhibition (May 29 (Wed) - 31 (Fri), 2024 at Tokyo Big Sight)!"
We are pleased to announce that our company will be exhibiting at the "JECA FAIR 2024, the 72nd Electrical Industry Exhibition," which will be held at Tokyo Big Sight from May 29 (Wednesday) to May 31 (Friday). We kindly invite you to visit our booth during this time, and we sincerely look forward to your attendance despite your busy schedule. Exhibition: "JECA FAIR 2024, the 72nd Electrical Industry Exhibition" (https://www.jecafair.jp/) Date: May 29 (Wednesday) to May 31 (Friday), 2024 Time: 10:00 AM to 5:00 PM (Opening at 10:30 AM on the first day and closing at 4:30 PM on the last day) Location: Tokyo Big Sight, Halls 1, 2, and 3 Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 Booth No.: 3-29 Nikko Electric Co., Ltd. Satellite Akiba Address: 4th Floor, Yuki Building, 23-2 Kanda Higashimatsushita-cho, Chiyoda-ku, Tokyo TEL: 03-3518-5050 FAX: 03-3518-5051
Corresponding to the full liberalization of electricity, we offer snow melting power contracts! Non-polluting and can be installed in various locations.
- Other heaters
The transformer manufacturer Nikkodenki will exhibit at booth 3-29 at "JECA FAIR 2024, the 72nd Electrical Installation Industry Exhibition (May 29 (Wed) - 31 (Fri), 2024 at Tokyo Big Sight)!"
We are pleased to announce that our company will be exhibiting at the "JECA FAIR 2024, the 72nd Electrical Industry Exhibition," which will be held at Tokyo Big Sight from May 29 (Wednesday) to May 31 (Friday). We kindly invite you to visit our booth during this time, and we sincerely look forward to your attendance despite your busy schedule. Exhibition: "JECA FAIR 2024, the 72nd Electrical Industry Exhibition" (https://www.jecafair.jp/) Date: May 29 (Wednesday) to May 31 (Friday), 2024 Time: 10:00 AM to 5:00 PM (Opening at 10:30 AM on the first day and closing at 4:30 PM on the last day) Location: Tokyo Big Sight, Halls 1, 2, and 3 Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 Booth No.: 3-29 Nikko Electric Co., Ltd. Satellite Akiba Address: 4th Floor, Yuki Building, 23-2 Kanda Higashimatsushita-cho, Chiyoda-ku, Tokyo TEL: 03-3518-5050 FAX: 03-3518-5051
A comfortable winter free from the struggles of snow shoveling! Easy and effortless one-touch operation for anyone!
- Other heaters
The transformer manufacturer Nikkodenki will exhibit at booth 3-29 at "JECA FAIR 2024, the 72nd Electrical Installation Industry Exhibition (May 29 (Wed) - 31 (Fri), 2024 at Tokyo Big Sight)!"
We are pleased to announce that our company will be exhibiting at the "JECA FAIR 2024, the 72nd Electrical Industry Exhibition," which will be held at Tokyo Big Sight from May 29 (Wednesday) to May 31 (Friday). We kindly invite you to visit our booth during this time, and we sincerely look forward to your attendance despite your busy schedule. Exhibition: "JECA FAIR 2024, the 72nd Electrical Industry Exhibition" (https://www.jecafair.jp/) Date: May 29 (Wednesday) to May 31 (Friday), 2024 Time: 10:00 AM to 5:00 PM (Opening at 10:30 AM on the first day and closing at 4:30 PM on the last day) Location: Tokyo Big Sight, Halls 1, 2, and 3 Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 Booth No.: 3-29 Nikko Electric Co., Ltd. Satellite Akiba Address: 4th Floor, Yuki Building, 23-2 Kanda Higashimatsushita-cho, Chiyoda-ku, Tokyo TEL: 03-3518-5050 FAX: 03-3518-5051
It is also possible to connect multiple mats to a single power source for installation! Since it is an add-on, it is easy to install!
- Other heaters
The transformer manufacturer Nikkodenki will exhibit at booth 3-29 at "JECA FAIR 2024, the 72nd Electrical Installation Industry Exhibition (May 29 (Wed) - 31 (Fri), 2024 at Tokyo Big Sight)!"
We are pleased to announce that our company will be exhibiting at the "JECA FAIR 2024, the 72nd Electrical Industry Exhibition," which will be held at Tokyo Big Sight from May 29 (Wednesday) to May 31 (Friday). We kindly invite you to visit our booth during this time, and we sincerely look forward to your attendance despite your busy schedule. Exhibition: "JECA FAIR 2024, the 72nd Electrical Industry Exhibition" (https://www.jecafair.jp/) Date: May 29 (Wednesday) to May 31 (Friday), 2024 Time: 10:00 AM to 5:00 PM (Opening at 10:30 AM on the first day and closing at 4:30 PM on the last day) Location: Tokyo Big Sight, Halls 1, 2, and 3 Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 Booth No.: 3-29 Nikko Electric Co., Ltd. Satellite Akiba Address: 4th Floor, Yuki Building, 23-2 Kanda Higashimatsushita-cho, Chiyoda-ku, Tokyo TEL: 03-3518-5050 FAX: 03-3518-5051
Packing used around furnace equipment, high-performance fiber products requiring tensile strength.
- Heating device
- Industrial Furnace
- Electric furnace
An ideal insulation material that can be used from -190℃ to 1100℃ and exhibits excellent performance.
- Heating device
- Industrial Furnace
- Electric furnace
It has become possible to manufacture high-performance insulation materials flexibly to match costs.
- Industrial Furnace
- Heating device
- Electric furnace
High-temperature heat-resistant shoes with excellent safety and functionality.
- Heating device
- Industrial Furnace
- Safety shoes and sneakers
Experts in high-temperature insulation materials essential for heat treatment! We handle everything from insulation material selection to precision processing. *Free product catalog available (PDF dow...
- Electric furnace
- Heating device
- Industrial Furnace
It is a flexible heater that can meet various needs.
- Industrial Furnace
- Heating device
- Electric furnace
We process all types of insulation boards.
- Industrial Furnace
- Electric furnace
- Heating device
Would you like to reduce labor costs by simplifying the gasket replacement process with a clinker-made gasket that is less likely to stick to the flange?
- Industrial Furnace
- Pipe Fittings
- Piping Materials
Leave the sintering and pre-sintering of industrial chemical raw materials such as functional materials, electronic materials, and powder mixed materials to us.
- Contract manufacturing
- Processing Contract
- Industrial Furnace
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
- Annealing furnace
- Electric furnace
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
Tabletop small-sized experimental furnace - space-saving, with a maximum operating temperature of 2000°C! We also manufacture metal furnaces for reducing atmospheres.
- Heating device
- Electric furnace
- Other heaters
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
- Heating device
- Electric furnace
- Annealing furnace
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
- Annealing furnace
- Electric furnace
Multi-functional Sputtering System 【MiniLab-S060】
4 cathodes with Φ2 inch mounted Simultaneous film formation: 3-component simultaneous film formation (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed from the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coat) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.
- Annealing furnace
- Heating device
- Electric furnace
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
This is a heater for thin film experiments such as PVD and CVD, featuring excellent uniformity, heating characteristics, and controllability. RF/DC bias specifications are also available.
- Heating device
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
- Annealing furnace
- Heating device
- Electric furnace
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
It is a high-performance vacuum deposition source that can be used as a high-temperature heating cell for vacuum applications, with an organic deposition source up to 800°C and a metal deposition sour...
- Evaporation Equipment
- Heating device
- Electric furnace
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
Vacuum Ultra-High Temperature Cylindrical Heater Unit Maximum Temperature 1800°C (Graphite, C/C Composite)
- Ceramic Heater
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
![[Nanofurnace] BWS-NANO Thermal CVD ...](https://image.mono.ipros.com/public/product/image/0d0/2000191194/IPROS99314670218218380543.jpeg?w=280&h=280){kind=small}
Hot Wall Type Thermal CVD Equipment: A compact, high-performance CVD device ideal for fundamental research.
- CVD Equipment
- Annealing furnace
- Heating device
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
High-temperature crucible heating heater for vacuum use. A versatile heater unit that can be used as an organic deposition source at 800°C and a metal deposition source at 1500°C.
- Evaporation Equipment
- Heating device
- Electric furnace
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
It is possible to defrost while still in boxes such as cardboard and Styrofoam! High-frequency defroster "Tempatron"!
- Food Processing Equipment
- Other food machinery
- Heating device
Notice of Participation in the 36th West Japan Food Industry Creation Exhibition '26 (May 20, 2026 (Wed) - May 22 (Fri))
Yamamoto Vinita will be exhibiting at the "36th Western Japan Food Industry Creation Exhibition '26" held at Tokyo Big Sight. Booth Number: West 4 Hall, Booth No. W4-39-05 *Exhibited Equipment: High-Frequency Rapid Thawing Device TEMPERTRON-VI Type - Thawing of beef, pork, chicken, vegetables, seafood, etc. - Heating and melting of dairy products such as butter, margarine, and chocolate - Achieves automation and labor-saving through rapid thawing. - This device can effectively heat even thick raw materials to the center. On the day of the event, we will also have a consultation desk for specific inquiries regarding thawing, heating, drying, and sterilization using radio waves (high frequency and microwaves). [Reasons for Improvement with High-Frequency Thawing] - Automation and line integration from raw material thawing to product completion on the day. - Thawing and heating in a short time frame of 20 to 30 minutes. - Reduction of personnel through automation of thawing and continuous thawing processes. - Ensuring thorough thawing of the center (uniform thawing quality) (elimination of surface drip loss). - Thawing without using water (reduction of water usage) (improvement of hygiene) (improvement of labor environment). - Elimination of excessive thawing (eradication of refreezing: reduction of food waste: thawing the necessary amount at the necessary time). Various companies have achieved improvements in their issues.
A heating device that is compact and heats quickly.
- Heating device
![[Heating Device] Secondary steriliz...](https://image.mono.ipros.com/public/product/image/b1f/2000603428/IPROS00291506596891138127.jpeg?w=280&h=280){kind=small}
A compact and time-efficient sterilization device. It contributes to food waste reduction.
- Heating device
![[Case Study] What are the results o...](https://image.mono.ipros.com/public/product/image/3f9/2000605712/IPROS10088947698618592946.jpeg?w=280&h=280){kind=small}
No need for temperature adjustment since the day before, improved yield even with thawing on the day!
- Heating device
Notice of Participation in the 36th West Japan Food Industry Creation Exhibition '26 (May 20, 2026 (Wed) - May 22 (Fri))
Yamamoto Vinita will be exhibiting at the "36th Western Japan Food Industry Creation Exhibition '26" held at Tokyo Big Sight. Booth Number: West 4 Hall, Booth No. W4-39-05 *Exhibited Equipment: High-Frequency Rapid Thawing Device TEMPERTRON-VI Type - Thawing of beef, pork, chicken, vegetables, seafood, etc. - Heating and melting of dairy products such as butter, margarine, and chocolate - Achieves automation and labor-saving through rapid thawing. - This device can effectively heat even thick raw materials to the center. On the day of the event, we will also have a consultation desk for specific inquiries regarding thawing, heating, drying, and sterilization using radio waves (high frequency and microwaves). [Reasons for Improvement with High-Frequency Thawing] - Automation and line integration from raw material thawing to product completion on the day. - Thawing and heating in a short time frame of 20 to 30 minutes. - Reduction of personnel through automation of thawing and continuous thawing processes. - Ensuring thorough thawing of the center (uniform thawing quality) (elimination of surface drip loss). - Thawing without using water (reduction of water usage) (improvement of hygiene) (improvement of labor environment). - Elimination of excessive thawing (eradication of refreezing: reduction of food waste: thawing the necessary amount at the necessary time). Various companies have achieved improvements in their issues.
![[Case Study] You can melt candies a...](https://image.mono.ipros.com/public/product/image/d3f/2000605714/IPROS55231550774228731234.jpeg?w=280&h=280){kind=small}
Even poorly formed candies can be melted down without compromising quality. Achieve zero waste!
- Heating device
![[Technical Data Presentation] Micro...](https://image.mono.ipros.com/public/product/image/37438/IPROS7696124350927171022.png?w=280&h=280){kind=small}
Introducing a microwave heating device systematized to accommodate various forms, particularly a mass production system powered by high power!
- Heating device
We will organize the differences in heating methods between microwave and high-frequency dielectric heating, and introduce specific practical examples of processes where these technologies are applied...
- High frequency/microwave parts
- Heating device
Thaw while still in the box! Contributing to improved productivity in food manufacturing.
- Food Processing Equipment
- Other food machinery
- Heating device
![[Defrosting Device] High-Frequency ...](https://image.mono.ipros.com/public/product/image/676/37438001/IPROS01307346816784414808.png?w=280&h=280){kind=small}
Quality preservation of frozen food ingredients! Continuous and high-speed processing of large quantities of frozen products. Automation of the entire process from thawing to processing has been achie...
- Heating device
![[Drying Example] Are there drying a...](https://image.mono.ipros.com/public/product/image/fc8/2000605036/IPROS46076670522744260421.jpeg?w=280&h=280){kind=small}
A drying device that is compact and dries in a short time. It does not compromise flavor or quality after drying.
- Heating device
![[Case Study] What is a defrosting d...](https://image.mono.ipros.com/public/product/image/e26/2000605715/IPROS64840494604985502791.jpeg?w=280&h=280){kind=small}
High-frequency waves allow for the defrosting of food while still in cardboard. Add value with delivery after defrosting!
- Heating device
![[Case Study] Can frozen fish be tha...](https://image.mono.ipros.com/public/product/image/d52/2000605717/IPROS62465583042188273581.jpeg?w=280&h=280){kind=small}
By introducing a high-frequency thawing device, we can achieve a reduction in the processes of "breaking down raw materials and loosening in running water"! Here are examples of frozen raw materials (...
- Heating device