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  6. 50μm thick ultra-thin glass non-contact transport device LNAS type

50μm thick ultra-thin glass non-contact transport device LNAS type

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50μm thick ultra-thin glass non-contact transport device LNAS type

last updated:Jan 10, 2018

ソーラーリサーチ研究所 大阪事業所
ソーラーリサーチ研究所 大阪事業所
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Non-contact transport of ultra-thin glass substrates with a thickness of 50μm - Non-contact transport device "50μm Thick Ultra-Thin Glass Non-Contact Transport Device LNAS Type"

The non-contact suction mechanism of the "50μm thick ultra-thin glass non-contact transport device LNAS type" is equipped with a gas deflector directly below the air jet nozzle. The gas deflector redirects the high-pressure air flow ejected from the nozzle at a right angle, causing it to collide directly with the ultra-thin glass without damaging it. Therefore, as shown in the pressure distribution diagram, there is no localized stress applied to the ultra-thin glass by the high-pressure ejected air (it is in a negative pressure state). As a result, thin workpieces and fragile ultra-thin glass will not be damaged.

    Stepper
LNA型(1).JPG

50μm thick ultra-thin glass non-contact transport device LNAS type

LNA型(1).JPG
LNA型(1).JPG
  • Related Link - http://www.solarlab.co.jp/lnas

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basic information

The non-contact suction mechanism of the "50μm thick ultra-thin glass non-contact transport device LNAS type" has the function of holding the ultra-thin glass in a suspended state without contact by ejecting air. The "0.05mm thick ultra-thin glass non-contact transport device LNAS type" is equipped with a gas deflector directly below the air ejection nozzle. The gas deflector redirects the high-pressure air flow ejected from the nozzle at a right angle, causing it to collide directly with the ultra-thin glass without damaging it. Therefore, it does not apply localized stress to the ultra-thin glass due to the high-pressure ejected air. As a result, thin and fragile workpieces are not damaged.

Price information

Meeting

Price range

P6

Delivery Time

Please contact us for details

Applications/Examples of results

Ultra-thin glass manufacturing line, transportation line, inspection line transportation.

Company information

ソーラーリサーチ研究所

ソーラーリサーチ研究所 大阪事業所

Electronic Components and Semiconductors

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Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.

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