Non-contact transport system for glass substrates
Non-contact transport device for LCD glass substrates
Non-contact transport system for glass substrates
The newly developed "Float Chuck Type C" series further adds and maximizes the effects of inertial force. It adopts a new mechanism for the gas ejection system, significantly increasing the suspension capability compared to conventional technology, while reducing gas consumption by nearly half. As a result, it is being considered for use with heavy loads that were previously avoided due to air consumption issues, particularly for the 8th generation large glass substrates (2200mm x 2200mm) and PDP large glass substrates (2000mm x 2000mm) for non-contact transport. Additionally, the reduction in exhaust gas makes it suitable for use in clean rooms. It excels in holding stability, is resistant to impact, and does not put stress on glass substrates. It is also widely used for the non-contact transport of thin semiconductor wafers.
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basic information
The newly developed "Float Chuck Type C" series adds and maximizes the effects of inertial force. It adopts a new mechanism for the gas ejection system, significantly increasing the suspension capability compared to conventional technology, while reducing gas consumption by nearly half. As a result, it can now accommodate heavy loads that were previously avoided due to air consumption issues, particularly the eighth generation large glass substrates (2200mm x 2200mm). Additionally, the reduction in exhaust gas makes it suitable for use in clean rooms. It excels in holding stability, is resistant to shocks, and does not put stress on glass substrates. It is also widely used for non-contact transport of thin semiconductor wafers.
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Applications/Examples of results
The newly developed "Float Chuck Type C" series further adds and maximizes the effects of inertial force. It adopts a new mechanism for the gas ejection system, significantly increasing the suspension capability compared to conventional technology, while reducing gas consumption by nearly half. As a result, it is being considered for use in non-contact transport of high-load workpieces, particularly the 8th generation large glass substrates for LCDs (2200mm x 2200mm) and large glass substrates for PDPs (2000mm x 2000mm), which had previously been avoided due to air consumption issues. Additionally, the reduced exhaust gas makes it suitable for use in clean rooms. It excels in holding stability, is resistant to impact, and does not put stress on glass substrates. It is also widely used for non-contact transport of thin semiconductor wafers.
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
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