Design, structure, assembly technology of LED packages, and implementation technology on substrates.
S10322
Trends in transparent resin: resin with phosphors! Low-stress resin! High refractive index! New manufacturing methods (multi-wavelength tandem, MCM, organic LED).
Speaker: Mr. Gen Murakami, President of Mototen Co., Ltd., Doctor of Engineering Venue: Tekno Kawasaki, 5th Floor, Room 5 Date and Time: March 29, 2011 (Tuesday) 12:30-16:30
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basic information
**Course Objectives and Aims** Semiconductor packaging technology is a crucial technology that enhances the functionality of electronic devices, alongside semiconductor miniaturization technology and logic design technology. It continues to lead the world in semiconductor packaging materials and assembly equipment. In recent years, the technology has evolved from System in Package (SiP) using multi-layer stacking of devices to Multi functions in a Package (MiP), which integrates not only electronic conduction but also wireless (RF) and optical (photon) functions within a single package. As LED assembly technology becomes an important technology that paves the way for the MiP era, this course will provide an overview of the current LED assembly technology and discuss future development directions and its impact on the market.
Price information
49,350 yen (including tax and text costs) for up to 2 people from one company. New members who apply for the first time by March 16 will receive an early bird discount price of 44,100 yen.
Price range
P2
Delivery Time
P2
Applications/Examples of results
1. Introduction 1-1. Purpose of Semiconductor Packaging 1-2. Development of Semiconductor Packaging 1-3. Development of LED Devices 2. Assembly Technology for LED Packages 2-1. Types and Manufacturing Methods of LED Elements 2-1-1. Types - GaAs-based, InGaN-based, GaN, SiC, etc. Light and Wavelength, Band Structure - Surface structures within elements to improve reflection efficiency - Trapezoidal elements, thin element design 2-1-2. Manufacturing Methods - Organic-Inorganic Vapor Deposition (MOCVD), Transparent Electrodes, Gold Electrodes 2-1-3. Topics on New Manufacturing Methods 2-2. Assembly Technology for LED Elements 2-3. Transparent Resins for LEDs 2-4. Phosphor Coating Technology 3. Materials for LED Device Mounting Boards 3-1. How to Choose High Thermal Conductivity Printed Circuit Board Materials 3-2. Challenges and Countermeasures for Soldering LED Elements - Issues with RoHS-compliant soldering materials 4. Reliability Evaluation Methods for LED Elements 4-1. Reliability Issues 4-2. Points to Consider for Evaluation 4-3. How to Conduct Evaluations 5. Domestic and International Markets for LEDs [Q&A, Business Card Exchange]
Company information
Our company has developed its business from "seminar planning" to various forms such as "lecturer dispatch," "publishing planning," "technical consultant dispatch," "trend research," "business matching," and "business development consulting," in order to support clients in a wide range of fields including chemistry, electronics, automotive, energy, medical devices, food, and building materials. By doing so, we have advanced our company and opened up new markets. AndTech promises to continue listening to our clients' voices, entering the business areas and markets they desire, and to remain a company that is loved by our clients, as we share their challenges, think together, and forge new paths.