We will identify the malfunctioning components and physical defects of the faulty circuit board.
We conduct functional inspections of substrates, stress tests, and reliability evaluations of soldered areas, and we quickly identify (analyze) the failure points of defective substrates and carry out repairs. Additionally, by identifying the causes of defects and providing feedback, we contribute to improving the yield of mass-produced products and enhancing market quality.
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basic information
**Features** - Tracing of faulty signal timing waveforms: Identify the faulty areas of digital circuits using digital oscilloscopes and trace faulty signal timing waveforms. - Open and short checks: Accurately identify physical faults. - Utilization of 3D X-ray CT: (Non-destructive testing support / 3D oblique X-ray imaging, CT inspection equipment) Trace solder and internal layer pattern defects of BGA balls. - Analysis of fault conditions: Based on the analysis of solder joint defect conditions through cross-sectioning, deduce the causes. For more details, please contact us.
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Company information
Since our establishment, we have consistently engaged in the manufacturing of computer application products and peripheral devices. With the manufacturing capabilities cultivated through our assembly production, we respond to printed circuit board assembly, analysis, and repair swiftly and with high quality.
