Peel off the substrate layer by layer to extract wiring information! We also have a track record with substrates that have limited applications.
Our PCB and FPC substrate analysis service removes the layers of the substrate to extract wiring information. We receive many requests for automotive substrates, but we also have extensive experience with substrates that have specific applications, such as high-density mounted substrates like those used in smartphones, as well as ceramic substrates for high-frequency and camera modules. Additionally, we can provide data in Gerber format or DFX format (optional). 【Features】 - Proven track record with substrates that have specific applications, such as high-density mounted substrates like those used in smartphones, and ceramic substrates for high-frequency and camera modules. - Data can also be provided in Gerber format or DFX format (optional). *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Our company is a technology service provider that specializes in delivering technical information (reports) tailored to our customers' needs, utilizing both the semiconductor-based analysis technology we have developed over many years since 1988 and our extensive experience in the investigation and analysis of intellectual property (IP) such as patents.
![[Case Study] Complete automation of internal and external data collaboration using RPA tools selectively.](https://image.mono.ipros.com/public/product/image/cec/2000612286/IPROS42123489930455960283.png?w=280&h=280)
