Highly skilled professionals certified through strict internal and external training programs will handle this.
We conduct functional inspections of substrates, stress tests, and reliability evaluations of soldered areas, quickly identifying (analyzing) the failure points of defective substrates and repairing them. Additionally, by identifying the causes of defects and providing feedback, we contribute to improving the yield of mass-produced products and enhancing market quality.
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basic information
【Features】 ○ BGA Replacement: Conditions are set based on the verification of joint reliability. (Pitch: 0.4mm or more, 3mm to 50mm) ○ Replacement of general components and soldering repairs: Both eutectic solder and lead-free solder are managed separately. ○ Modifications to the circuit board: We respond with high skill even when pattern cuts, jumper wiring, or component replacements are necessary due to design changes, etc. ● For more details, please contact us.
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Company information
Since our establishment, we have consistently engaged in the manufacturing of computer application products and peripheral devices. With the manufacturing capabilities cultivated through our assembly production, we respond to printed circuit board assembly, analysis, and repair swiftly and with high quality.