Leave module and LGA component replacement to us!
◎Capable of implementing, replacing, and reworking module components ◎Compatible with LGA (Land Grid Array) packages
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basic information
For more details, please refer to the PDF document or feel free to contact us.
Price information
Estimated labor cost for parts replacement (rework) BGA: 3,500 yen to 8,000 yen Module: 3,500 yen to 8,000 yen QFN: 1,500 yen to 4,000 yen FET: 800 yen to 2,000 yen QFP/SOP: 500 yen to 3,000 yen Estimated labor cost for BGA reballing Up to 5 pieces: 4,000 yen per piece 6 to 9 pieces: 3,500 yen per piece 10 to 19 pieces: 3,000 yen per piece
Price range
P1
Delivery Time
Applications/Examples of results
◎Changes to parts during prototyping ◎Correction of assembly defects ◎Rework in case of lot defects
catalog（2）
Download All Catalogs![[Case Study] Module and LGA Replacement Work](https://image.mono.ipros.com/public/catalog/image/01/6d1/461244/IPROS5559172104454605040.jpg?w=120&h=170)
Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
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