We will continue to strive towards the future of solder mask materials.
Our solder masking agent is a paste-type masking agent developed for masking the mounting locations of retrofitted components on printed circuit boards during wave soldering and reflow soldering processes. Various combinations can be achieved through different application, curing, and removal methods, so please select the most suitable masking agent according to your needs.
Inquire About This Product
basic information
【Features】 ○ We will improve the product to meet your company's needs. ○ A wide variety of products. ○ Detailed technical support. ● For more information, please contact us.
Price information
Please feel free to contact us.
Delivery Time
※Please feel free to contact us.
Applications/Examples of results
Post-assembly components section - eutectic solder / Post-assembly components section - lead-free solder / Plating - etching mask / Solder leveler - eutectic solder / Solder leveler - lead-free solder / Gold plating section - carbon contact section / Potting mask
Company information
The solder masking agent business, which has a wide range of products and deep technology, was transferred to Tokyo Electron Materials Co., Ltd. on September 4, 2007, for further strengthening and development of the business. Tokyo Electron Materials Co., Ltd. aims to engage in activities specialized in the solder masking agent business, make technological improvements, develop products that match market needs, and contribute to the industry.
