4/19【Seminar】 Latest Technologies in Metal/Resin Joining and Interface Strength Prediction Techniques
An explanation of the latest technological trends in injection molding for difficult dissimilar material bonding (NMT), adhesive strength prediction technology, and direct bonding using lasers (LAMP bonding).
Acquired Knowledge: By gaining insights into the latest technologies for metal/polymer bonding and interfacial adhesion strength, which are considered difficult to achieve, we can contribute to improving the bonding reliability of our products.
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【Date】 April 19, 2011 (Tuesday) 10:30 AM - 5:30 PM 【Venue】 Japan Techno Center Training Room 22nd Floor, Odakyu Dai-ichi Seimei Building, 2-7-1 Nishi-Shinjuku, Shinjuku-ku, Tokyo 【Target Audience】 ● Engineers responsible for dissimilar material joining in various vehicles, machinery, and electronic devices 【Program】 I) Injection Molding Technology for Metal + Resin (NMT) 10:30 AM - 12:30 PM II) Technology for Predicting Adhesion Strength at Dissimilar Material Interfaces Using Molecular Simulation 1:20 PM - 3:20 PM III) Direct Joining of Metal and Resin Using Laser (Laser-Assisted Metal and Plastic Joining) 3:30 PM - 5:30 PM ■□■ For more details, please request materials or contact us ■□■
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We are committed to conveying the specialized technical information and skills that our customers require through seminars, publications, and media such as software, and by providing timely services, we aim to ensure that our customers feel the necessity of our company. Furthermore, our corporate vision is to network the valuable knowledge and know-how of engineers and researchers, what is known as humanware and technology, to build an advanced society.