To prevent equipment failure due to heat! Let's learn about cooling methods, selection, how to utilize simulators, and temperature measurement techniques!
Learn how to incorporate heat dissipation design into the development schedule and apply it to heat dissipation measures at each stage from the initial phase to manufacturing!
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【Date】 May 11, 2011 (Wednesday) 10:30 AM - 5:30 PM 【Venue】 Japan Techno Center Training Room 22nd Floor, Odakyu Dai-ichi Seimei Building, 2-7-1 Nishi-Shinjuku, Shinjuku-ku, Tokyo 【Target Audience】 Personnel involved in the design and development of electronic devices and components 【Program】 I. What is thermal design? II. Development process III. Specification review stage IV. Basic experimentation stage V. Development and design stage VI. Prototyping and evaluation stage VII. Manufacturing transfer stage VIII. Follow-up after transfer IX. Common items (to be addressed in each chapter) 1. What to do and its impact at each development stage 2. How to incorporate into the development schedule 3. How to utilize simulators 4. Methods for measuring temperature 5. Things to do and things not to do 6. Ways to improve understanding and appeal regarding thermal design ■□■ For details, please request materials or contact us ■□■
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We are committed to conveying the specialized technical information and skills that our customers require through seminars, publications, and media such as software, and by providing timely services, we aim to ensure that our customers feel the necessity of our company. Furthermore, our corporate vision is to network the valuable knowledge and know-how of engineers and researchers, what is known as humanware and technology, to build an advanced society.
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