We offer services for forming thin films from a small quantity up to thick films over 20μm!
Our "PE-TEOS Film Thick Film Formation Service" can form films ranging from thin films to thick films over 20μm, and is capable of processing substrates with films, substrates in the middle of processing, compound semiconductor wafers, ceramic substrates, and more. Due to its parallel plate design, small pieces and chips can also be processed, with sizes up to 8 inches in diameter. We can accommodate small quantities as well. 【Features】 ■ Capable of processing substrates with films, compound semiconductor wafers, ceramic substrates, etc. ■ Can be used as a hard mask ■ The parallel plate design allows for the processing of small pieces, chips, and rectangular substrates ■ Can also be used as a protective film for MEMS structures ■ Small pieces, chips, and rectangular substrates can also be cut ■ Suitable for bonding and lamination applications *For more details, please refer to the PDF document or feel free to contact us.
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Assist Navi prioritizes customer requests above all, striving to provide satisfactory products and services with a motto of speedy response and a spirit of challenge. We aim to maintain a flexible system and innovative thinking to adapt to market changes at all times.